Electronics Heating & Cooling Components
CATEGORIES
Prix (Le prix affiché est H.T.) | Description | Détails du produit |
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Heatsink, TO-218, TO-220, TO-247
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Arcol Ohmite Thermal Interface Pad, 0.5mm Thick, 3W/m·K, Silicone, 49.1x28mm
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Heatsink, For TGHE Series and SOT-227, 48.7 x 55 x 30mm, Panel
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Heatsink, For TGHE Series and SOT-227, 48.7 x 55 x 30mm, Panel
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Heatsink, TO-218, TO-220, TO-247
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Arcol Ohmite Thermal Interface Pad, 0.5mm Thick, 3W/m·K, Silicone, 49.1x28mm
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Heatsink, TO-252, TO-263 and TO-268, 12.7 x 30.99 x 11.68mm
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Heatsink, 0.9°C/W, 152 x 105 x 44mm, Screw
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Heatsink, TO-252, TO-263 and TO-268, 12.7 x 35.31 x 11.68mm
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Heatsink, TO-247 and TO-264 Devices, 55 x 31 x 38mm, Vertical
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Heatsink, TO263, 12 x 25 x 10mm
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Heatsink, TO-247 and TO-264 Devices, 55 x 31 x 38mm, Vertical
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Arcol Ohmite Thermal Interface Pad, 0.5mm Thick, 3W/m·K, Silicone, 89.7x72.5mm
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Heatsink, TO-247, 23.1 x 16 x 35.6mm
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Heatsink, IXYS I4 and CPC PAK, Ohmite CS10, TO-220, TO-247, 55 x 33.9 x 39.5mm
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Heatsink, 0.4°C/W, 152 x 248 x 58mm, Screw
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Heatsink, TO-220 and TO-247 Devices and Bridge Rectifiers, 16.28 x 16.3 x 38.1mm, PCB Through Hole
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Heatsink, BGA, CPU and GPU, 27 x 27 x 17.5mm, PCB Mount
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Heatsink, BGA, CPU and GPU, 42.5 x 42.5 x 12.5mm, PCB Mount
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Heatsink, BGA, CPU and GPU, 17 x 17 x 7.5mm, PCB Mount
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