Vishay E Type N-Channel Power MOSFET, 48 A, 650 V Depletion, 8-Pin PowerPAK 10 x 12

Sous-total (1 bobine de 2000 unités)*

7 814,00 €

(TVA exclue)

9 454,00 €

(TVA incluse)

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la bobine*
2000 +3,907 €7 814,00 €

*Prix donné à titre indicatif

N° de stock RS:
239-8633
Référence fabricant:
SIHK045N60E-T1-GE3
Fabricant:
Vishay
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Marque

Vishay

Channel Type

Type N

Product Type

Power MOSFET

Maximum Continuous Drain Current Id

48A

Maximum Drain Source Voltage Vds

650V

Package Type

PowerPAK 10 x 12

Series

E

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

0.043Ω

Channel Mode

Depletion

Minimum Operating Temperature

-55°C

Forward Voltage Vf

1.2V

Typical Gate Charge Qg @ Vgs

98nC

Maximum Gate Source Voltage Vgs

30V

Maximum Power Dissipation Pd

278W

Maximum Operating Temperature

+150°C

Standards/Approvals

RoHS

Automotive Standard

AEC-Q101

Vishay Series E Power MOSFET, 650V Drain Source Voltage, 48A Continuous Drain Current - SIHK045N60E-T1-GE3


This power MOSFET is a high-voltage N-channel semiconductor device designed for switching and power management in demanding electrical systems. It operates across a wide temperature range and is intended for surface-mounted assemblies where automotive-level reliability and high continuous current handling are required.

Features and Benefits:


• 650V drain voltage enabling high-voltage switching applications • 48A continuous drain current supporting heavy current loads • 0.043Ω Rds(on) reducing conduction losses under load • 98nC typical gate charge allowing predictable drive requirements • 278W maximum power dissipation for substantial thermal handling • AEC-Q101 qualification meeting automotive stress screening needs

Applications


• Suitable for traction inverter and motor-control stages in vehicles • Ideal for high-voltage power converters in industrial automation • Used for DC-DC conversion in high-power electrical systems • Can be used for switch-mode power supplies in demanding environments

What gate drive considerations should I allow for?


Design gate drivers to deliver around the typical 98nC charge at the chosen Vgs to ensure switching speed meets system timing while limiting switching losses.

How should thermal management be approached on PCB assemblies?


Use the PowerPAK 10x12 surface package heat-spreading and provision for adequate copper area and vias to dissipate up to 278W under defined cooling conditions.

What voltage margins are appropriate for safety design?


Select system operating voltages well below the 650V maximum drain-source rating and limit gate excursions within the ±30V gate-source constraint.

Are there environmental temperature constraints for operation?


The device functions from -55°C up to +150°C junction temperature, so system cooling and derating must account for high-temperature operating points.

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