Vishay SIHK Type N-Channel MOSFET, 21 A, 650 V Enhancement, 8-Pin PowerPAK 10 x 12 SIHK125N60EF-T1GE3

Sous-total (1 bobine de 2000 unités)*

4 320,00 €

(TVA exclue)

5 220,00 €

(TVA incluse)

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  • Expédition à partir du 15 février 2027
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Unité
Prix par unité
la bobine*
2000 +2,16 €4 320,00 €

*Prix donné à titre indicatif

N° de stock RS:
268-8312
Référence fabricant:
SIHK125N60EF-T1GE3
Fabricant:
Vishay
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Marque

Vishay

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

21A

Maximum Drain Source Voltage Vds

650V

Series

SIHK

Package Type

PowerPAK 10 x 12

Mount Type

PCB

Pin Count

8

Maximum Drain Source Resistance Rds

0.125Ω

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

45nC

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

132W

Forward Voltage Vf

1.2V

Maximum Operating Temperature

150°C

Length

9.9mm

Standards/Approvals

RoHS

Automotive Standard

No

Pays d'origine :
CN

Vishay SIHK Series MOSFET, 650V Maximum Drain Source Voltage, 21A Maximum Continuous Drain Current - SIHK125N60EF-T1GE3


This MOSFET is a high-voltage N-channel switching transistor designed for power conversion and control on printed circuit boards. It operates across a wide thermal range and is intended for applications requiring robust voltage handling and moderate current capacity in a PCB-mounted PowerPAK package.

Features and Benefits:


• 650V drain capability for high-voltage switching
• 21A continuous drain current for steady power delivery
• 0.125Ω low Rds(on) to reduce conduction losses
• 132W power dissipation for thermal headroom
• 45nC typical gate charge for predictable switching energy
• 30V gate-source rating for flexible gate drive levels

Applications


• Suitable for switch-mode power supplies in industrial equipment
• Ideal for high-voltage motor-drive front ends
• Used with isolated gate drivers in power converters
• Can be used for power-factor-correction stages
• Suitable for inverter circuits in renewable-energy systems

What package is provided for PCB assembly and thermal management?


The component is supplied in a PowerPAK 10x12 surface-mount package designed for PCB mounting to assist heat transfer to the board and facilitate solder-based thermal paths.

What thermal extremes can the device withstand in operation?


It is specified to function from -55°C up to 150°C, enabling use in environments with substantial temperature variation.

How does the device behave as a gate-driven switch?


It is an enhancement-mode N-channel MOSFET that requires a positive gate-source voltage up to its 30V limit to conduct, and its typical gate charge of 45nC informs switching-energy calculations.

Are there any environmental or regulatory attributes noted?


The device complies with RoHS requirements for restricted substances, aligning with standard electronic component environmental directives.

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