Infineon OptiMOS N-Channel MOSFET, 50 A, 60 V Enhancement, 3-Pin TO-252 IPD50N06S409ATMA2

Sous-total (1 bobine de 2500 unités)*

822,50 €

(TVA exclue)

995,00 €

(TVA incluse)

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2500 +0,329 €822,50 €

*Prix donné à titre indicatif

N° de stock RS:
223-8517
Référence fabricant:
IPD50N06S409ATMA2
Fabricant:
Infineon
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Marque

Infineon

Channel Type

N

Product Type

MOSFET

Maximum Continuous Drain Current Id

50A

Maximum Drain Source Voltage Vds

60V

Series

OptiMOS

Package Type

TO-252

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

9mΩ

Channel Mode

Enhancement

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

17nC

Maximum Power Dissipation Pd

71W

Forward Voltage Vf

950mV

Maximum Gate Source Voltage Vgs

20V

Maximum Operating Temperature

175°C

Standards/Approvals

No

Automotive Standard

No

Infineon OptiMOS Series MOSFET, 60V Maximum Drain Source Voltage, 50A Maximum Continuous Drain Current - IPD50N06S409ATMA2


This MOSFET is a surface-mount N-channel enhancement device designed to control power in electronic systems requiring high current and moderate voltage handling. It operates across a wide temperature range suitable for demanding thermal environments and is intended for use where efficient switching and power management are required.

Features and Benefits:


• Low on-resistance reduces conduction losses during high-current operation
• High continuous drain capability supports sustained 50 A currents
• 60 V drain-source rating enables mid-voltage power stages
• 71 W power dissipation allows handling of elevated thermal loads
• 17 nC typical gate charge enables relatively fast switching transitions
• 20 V gate tolerance accommodates higher gate-drive voltages

Applications


• Suitable for synchronous buck converter switching stages
• Ideal for motor-driver power stages in industrial controllers
• Used with battery-management systems requiring high current handling
• Can be used for DC-DC power conversion in telecoms equipment
• Appropriate for power distribution modules on surface-mounted assemblies

What is the device’s allowable gate-drive range?


The gate may be driven up to 20 V between gate and source without exceeding its gate-voltage limit.

How does the thermal range affect deployment in harsh environments?


It remains operational from −55 °C to 175 °C so it can function in wide-temperature applications where thermal extremes occur.

What packaging and mount method does it use for assembly?


It is supplied in a TO-252 package designed for surface-mount placement on assemblies.

What conduction characteristic indicates efficiency during on-state?


A maximum drain-source resistance of 9 mΩ minimises voltage drop and conduction losses at high currents.

How does forward voltage impact low-voltage power stages?


A forward voltage of 0.95 V limits additional voltage drop across the device during conduction, aiding efficiency.

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