Infineon OptiMOS P Type P-Channel MOSFET, 1.5 A, 30 V Enhancement, 3-Pin SOT-23
- N° de stock RS:
- 165-8258
- Référence fabricant:
- BSS314PEH6327XTSA1
- Fabricant:
- Infineon
Offre groupée disponible
Consulter les options de prix de grosSous-total (1 bobine de 3000 unités)*
228,00 €
(TVA exclue)
276,00 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
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Unité | Prix par unité | la bobine* |
|---|---|---|
| 3000 - 3000 | 0,076 € | 228,00 € |
| 6000 - 12000 | 0,072 € | 216,00 € |
| 15000 + | 0,067 € | 201,00 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 165-8258
- Référence fabricant:
- BSS314PEH6327XTSA1
- Fabricant:
- Infineon
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Infineon | |
| Product Type | MOSFET | |
| Channel Type | Type P | |
| Maximum Continuous Drain Current Id | 1.5A | |
| Maximum Drain Source Voltage Vds | 30V | |
| Series | OptiMOS P | |
| Package Type | SOT-23 | |
| Mount Type | Surface | |
| Pin Count | 3 | |
| Maximum Drain Source Resistance Rds | 230mΩ | |
| Channel Mode | Enhancement | |
| Minimum Operating Temperature | -55°C | |
| Forward Voltage Vf | -1.1V | |
| Typical Gate Charge Qg @ Vgs | 2.9nC | |
| Maximum Power Dissipation Pd | 500mW | |
| Maximum Operating Temperature | 150°C | |
| Length | 2.9mm | |
| Standards/Approvals | No | |
| Height | 1.3mm | |
| Automotive Standard | AEC-Q101 | |
| Sélectionner tout | ||
|---|---|---|
Marque Infineon | ||
Product Type MOSFET | ||
Channel Type Type P | ||
Maximum Continuous Drain Current Id 1.5A | ||
Maximum Drain Source Voltage Vds 30V | ||
Series OptiMOS P | ||
Package Type SOT-23 | ||
Mount Type Surface | ||
Pin Count 3 | ||
Maximum Drain Source Resistance Rds 230mΩ | ||
Channel Mode Enhancement | ||
Minimum Operating Temperature -55°C | ||
Forward Voltage Vf -1.1V | ||
Typical Gate Charge Qg @ Vgs 2.9nC | ||
Maximum Power Dissipation Pd 500mW | ||
Maximum Operating Temperature 150°C | ||
Length 2.9mm | ||
Standards/Approvals No | ||
Height 1.3mm | ||
Automotive Standard AEC-Q101 | ||
- Pays d'origine :
- CN
Infineon OptiMOS P Series MOSFET, 30V Maximum Drain Source Voltage, 1.5A Maximum Continuous Drain Current - BSS314PEH6327XTSA1
This p-channel MOSFET serves as a compact surface-mount switching device for low-voltage power control in automotive and industrial electronics. Designed for enhancement-mode operation, it offers controlled conduction for power-path and load-switching tasks across a wide temperature range, making it suitable for demanding thermal environments.
Features and Benefits:
• 30V drain capability enables low-voltage system switching
• 230mΩ Rds(on) delivers efficient conduction for small loads
• 1.5A continuous drain current supports moderate current paths
• 2.9nC typical gate charge reduces switching energy losses
• 20V maximum gate-source rating allows flexible gate drive margins
• Automotive AEC‑Q101 qualification suits vehicle‑grade applications
• 230mΩ Rds(on) delivers efficient conduction for small loads
• 1.5A continuous drain current supports moderate current paths
• 2.9nC typical gate charge reduces switching energy losses
• 20V maximum gate-source rating allows flexible gate drive margins
• Automotive AEC‑Q101 qualification suits vehicle‑grade applications
Applications
• Suitable for battery management and protection circuits
• Ideal for load switching in automotive control modules
• Used with power rails in handheld and portable electronics
• Can be used for small-signal power switching in sensor nodes
• Suitable for surface-mount designs where board space is limited
• Ideal for load switching in automotive control modules
• Used with power rails in handheld and portable electronics
• Can be used for small-signal power switching in sensor nodes
• Suitable for surface-mount designs where board space is limited
What thermal extremes can it tolerate during operation?
It is specified to operate from -55°C up to 150°C, allowing use in environments with wide temperature variation.
How does the package influence board-level integration?
The SOT-23 surface-mount format permits compact placement and automated assembly on densely populated boards.
What power-handling constraints should designers consider?
The device dissipates up to 500mW, so adequate PCB copper and thermal layout are required to manage junction temperature under continuous load.
Which electrical limit governs gate drive selection?
Drive voltages must remain within ±20V relative to the source to avoid gate overstress and ensure reliable switching.
Liens connexes
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