Infineon SIPMOS Type N-Channel MOSFET, 260 mA, 240 V Enhancement, 3-Pin SOT-89 BSS87H6327FTSA1

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N° de stock RS:
752-8249
Référence fabricant:
BSS87H6327FTSA1
Fabricant:
Infineon
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Marque

Infineon

Channel Type

Type N

Product Type

MOSFET

Maximum Continuous Drain Current Id

260mA

Maximum Drain Source Voltage Vds

240V

Series

SIPMOS

Package Type

SOT-89

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

7.5Ω

Channel Mode

Enhancement

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

1W

Typical Gate Charge Qg @ Vgs

3.7nC

Maximum Operating Temperature

150°C

Height

1.5mm

Standards/Approvals

No

Length

4.5mm

Automotive Standard

AEC-Q101

Infineon SIPMOS Series MOSFET, 240V Maximum Drain Source Voltage, 1W Maximum Power Dissipation - BSS87H6327FTSA1


This MOSFET is a surface-mount switching device designed for low-current, high-voltage applications in automotive and industrial environments. It operates as an enhancement-mode N-channel transistor and is intended for compact board-level implementations where thermal endurance and voltage handling are required.

Features and Benefits:


• 240V drain capability enabling high-voltage switching applications
• 7.5 Ω maximum Rds(on) reducing conduction losses at low currents
• 1W maximum power dissipation for modest thermal loads
• 260 mA continuous drain current supporting small-signal switching
• Vgs rating of 20V permitting wide gate-drive tolerance
• Gate charge 3.7 nC allowing predictable switching energy management

Applications


• Suitable for auxiliary automotive control circuits
• Ideal for battery-management sensing and switching
• Used with driver ICs in power-limited converters
• Can be used for industrial signal-level high-voltage switching
• Used for compact surface-mount prototypes and small assemblies

What temperature range can it reliably endure in operation?


It is specified to function between -55 °C and 150 °C, allowing use across harsh ambient and elevated under‑bonnet conditions.

How many pins and what mounting format does it require on the PCB?


The device has three electrical leads and is supplied in an SOT-89 package for surface mounting.

How does the package size affect board-space planning?


Its compact 4.5 x 2.5 x 1.5mm envelope minimises footprint and supports dense layouts without external heatsinking for low-power designs.

Is the device suited to automotive qualification criteria?


It meets automotive-grade AEC‑Q101 standards, aligning with component selection for vehicle electronic subsystems.

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