Vishay SIHH Type N-Channel MOSFET, 13 A, 650 V Enhancement, 4-Pin PowerPAK 8 x 8 SIHH250N60EF-T1GE3

Sous-total (1 bobine de 3000 unités)*

5 946,00 €

(TVA exclue)

7 194,00 €

(TVA incluse)

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3000 +1,982 €5 946,00 €

*Prix donné à titre indicatif

N° de stock RS:
268-8302
Référence fabricant:
SIHH250N60EF-T1GE3
Fabricant:
Vishay
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Marque

Vishay

Channel Type

Type N

Product Type

MOSFET

Maximum Continuous Drain Current Id

13A

Maximum Drain Source Voltage Vds

650V

Series

SIHH

Package Type

PowerPAK 8 x 8

Mount Type

Surface

Pin Count

4

Maximum Drain Source Resistance Rds

0.25Ω

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

23nC

Forward Voltage Vf

1.2V

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

89W

Maximum Operating Temperature

150°C

Standards/Approvals

RoHS

Length

8mm

Automotive Standard

No

Pays d'origine :
TW

Vishay SIHH Series MOSFET, 650V Drain Source Voltage, 13A Continuous Drain Current - SIHH250N60EF-T1GE3


This MOSFET is a high-voltage switching device intended for power conversion and control applications where compact surface mounting is required. It operates as an enhancement-mode N-channel transistor and is designed to handle elevated voltages and currents in demanding thermal environments while conforming to RoHS restrictions.

Features and Benefits:


• 650V rating enables high-voltage switching capability
• 13A continuous current supports substantial load drive
• 0.25 Ω Rds(on) reduces conduction losses under load
• 89W power dissipation allows sustained thermal performance
• 23 nC typical gate charge permits moderate-speed gate transitions
• Vgs maximum 30V ensures robust gate-drive margin

Applications


• Suitable for offline switch-mode power supplies
• Ideal for high-voltage motor drive stages
• Used with isolated gate drivers in power converters
• Can be used for resonant and soft-switching topologies
• Suitable for industrial power-management modules

What temperature extremes can it tolerate in operation?


It is specified to operate across a wide temperature span from -55 °C up to 150 °C for use in harsh thermal conditions.

Which package and mounting method are provided for compact assemblies?


It is supplied in a PowerPAK 8x8 package intended for surface-mount placement to save board area and improve thermal conduction.

How does the device’s forward voltage affect body-diode conduction?


The forward voltage of 1.2V indicates the typical voltage drop across the intrinsic diode during reverse conduction, influencing loss calculations in synchronous rectification or freewheeling paths.

What pin configuration is available for circuit integration?


The component exposes four pins, facilitating separate connections for source, drain, gate and tab or thermal-pad arrangements during PCB layout.

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