TE Connectivity 1.02 mm Pitch 2011 Way Board IC Socket
- N° de stock RS:
- 477-581
- Numéro d'article Distrelec:
- 304-64-491
- Référence fabricant:
- 1554653-1
- Fabricant:
- TE Connectivity
Sous-total (1 plateau de 8 unités)*
265,52 €
(TVA exclue)
321,28 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Stocké-e par le fabricant
- Prêt à être expédié à partir du 02 juillet 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Plateau(x) | le plateau | Prix par unité* |
|---|---|---|
| 1 + | 265,52 € | 33,19 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 477-581
- Numéro d'article Distrelec:
- 304-64-491
- Référence fabricant:
- 1554653-1
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Product Type | IC Socket | |
| Current | 0.5A | |
| Number of Contacts | 2011 | |
| Pitch | 1.02mm | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Row Pitch | 1.02mm | |
| Termination Type | Solder | |
| Socket Mount Type | Board | |
| Maximum Operating Temperature | 260°C | |
| Standards/Approvals | China RoHS 2 Directive MIIT Order No 32, UL 94V-0, 2016, EU RoHS Directive 2011/65/EU Compliant, EU ELV Directive 2000/53/EC Compliant | |
| Housing Material | High Temperature Thermoplastic | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Product Type IC Socket | ||
Current 0.5A | ||
Number of Contacts 2011 | ||
Pitch 1.02mm | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Row Pitch 1.02mm | ||
Termination Type Solder | ||
Socket Mount Type Board | ||
Maximum Operating Temperature 260°C | ||
Standards/Approvals China RoHS 2 Directive MIIT Order No 32, UL 94V-0, 2016, EU RoHS Directive 2011/65/EU Compliant, EU ELV Directive 2000/53/EC Compliant | ||
Housing Material High Temperature Thermoplastic | ||
- Pays d'origine :
- CN
The TE Connectivity socket assembly is designed specifically for LGA2011 applications, ensuring reliable connectivity in a compact footprint. Engineered with a robust square frame, the socket facilitates efficient heat dissipation while maintaining signal integrity. It features advanced surface mount technology, which simplifies PCB assembly and enhances durability. The gold-plated contacts ensure optimal conductivity and resistance to corrosion, making it ideal for critical electronic applications. Compliance with industry standards guarantees that this socket meets stringent safety and environmental regulations, ensuring peace of mind for manufacturers and users alike. This product is an essential component for modern computing platforms, providing excellent performance and long-lasting reliability.
Advanced surface mount design for improved assembly processes
Square frame style optimises space efficiency
Gold plating on contacts maximises electrical performance
Designed for quick and effective thermal management
Compliant with UL flammability rating for enhanced safety
Low halogen content aligns with environmental considerations
Structured for reliable signal transmission in electronic circuits
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