TE Connectivity 0.99 mm Pitch 3647 Way Board IC Socket

Sous-total (1 plateau de 3 unités)*

263,57 €

(TVA exclue)

318,92 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 10 avril 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Plateau(x)
le plateau
Prix par unité*
1 +263,57 €87,857 €

*Prix donné à titre indicatif

N° de stock RS:
476-267
Numéro d'article Distrelec:
304-59-425
Référence fabricant:
2-2822979-4
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Product Type

IC Socket

Number of Contacts

3647

Current

0.5A

Pitch

0.99mm

Contact Material

Copper Alloy

Contact Plating

Gold

Row Pitch

0.99mm

Termination Type

Solder

Socket Mount Type

Board

Maximum Operating Temperature

260°C

Standards/Approvals

EU ELV Directive 2000/53/EC Compliant, UL 94V-0, China RoHS 2 Directive MIIT Order No 32, EU RoHS Directive 2011/65/EU Compliant, 2016

Housing Material

High Temperature Thermoplastic

Pays d'origine :
CN
The TE Connectivity LGA3647-1 SOCKET-P1 KIT is a cutting-edge solution designed for original design manufacturers (ODMs) requiring high-performance connectivity. This state-of-the-art socket kit offers an innovative approach to ensuring reliable connections while managing thermal efficiency. Tailored for advanced computing applications, its square frame design simplifies integration into various printed circuit boards. With a meticulous focus on durability and performance, this socket kit stands as a testament to modern engineering, catering to the demands of sophisticated electronics that require exceptional performance and precision.

Offers superior contact current ratings enhancing reliability during operation

Manufactured from high temperature thermoplastic ensuring longevity under stress

Features low halogen content aligning with environmental compliance standards

Utilises surface mount solder ball termination method for efficient PCB integration

Showcases a black housing colour contributing to aesthetic uniformity in designs

Provides precision grid spacing allowing flexibility in layout designs

Liens connexes