TE Connectivity 2.54 mm Pitch 24 Way Board DIP IC Socket
- N° de stock RS:
- 474-715
- Numéro d'article Distrelec:
- 304-63-486
- Référence fabricant:
- 3-1437536-9
- Fabricant:
- TE Connectivity
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
- N° de stock RS:
- 474-715
- Numéro d'article Distrelec:
- 304-63-486
- Référence fabricant:
- 3-1437536-9
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| IC Socket Type | DIP | |
| Product Type | IC Socket | |
| Current | 3A | |
| Number of Contacts | 24 | |
| Number of Rows | 2 | |
| Pitch | 2.54mm | |
| Orientation | Vertical | |
| Contact Material | Beryllium Copper Alloy | |
| Contact Plating | Gold | |
| Socket Mount Type | Board | |
| Row Pitch | 2.54mm | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 265°C | |
| Standards/Approvals | UL 94 V-0 | |
| Housing Material | Polyester | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
IC Socket Type DIP | ||
Product Type IC Socket | ||
Current 3A | ||
Number of Contacts 24 | ||
Number of Rows 2 | ||
Pitch 2.54mm | ||
Orientation Vertical | ||
Contact Material Beryllium Copper Alloy | ||
Contact Plating Gold | ||
Socket Mount Type Board | ||
Row Pitch 2.54mm | ||
Termination Type Solder | ||
Maximum Operating Temperature 265°C | ||
Standards/Approvals UL 94 V-0 | ||
Housing Material Polyester | ||
- Pays d'origine :
- CH
The TE Connectivity 524-AG10D-ES SOCKET ASSEMBLY is a sophisticated DIP socket designed to streamline connectivity within electronic circuits. Its advanced features ensure optimum performance and reliability for all your circuit design needs. Constructed with high-quality materials, this socket provides a robust interface, enhancing the integrity of connections and supporting various applications. Perfectly tailored for printed circuit board integration, this socket caters to both professional and hobbyist electrical engineers seeking to build resilient electronic systems. With vertical PCB mount orientation and a secure mating alignment type, the socket makes installation straightforward while assuring stability during operation. Its unique combination of features positions this DIP socket as a top choice in the market for high-tier connectivity solutions.
Comprises a closed frame style for added protection
Equipped with a standard profile to fit a variety of applications
Has a vertical PCB mount orientation for space efficient configurations
Utilises beryllium copper for optimal conductivity in contact features
Features a wave solder capability simplifying manufacturing processes
Offers reliable electrical characteristics ensuring consistent performance
Liens connexes
- TE Connectivity 2.54 mm Pitch 20 Way DIP Through Hole DIP IC Socket
- TE Connectivity 2.54 mm Pitch 20 Way DIP Board DIP IC Socket
- TE Connectivity 2.54 mm Pitch 16 Way DIP Board IC Socket
- TE Connectivity 2.54 mm Pitch 24 Way Surface DIP IC Socket
- TE Connectivity 2.54 mm Pitch 28 Way DIP Through Hole DIP IC Socket
- TE Connectivity 2.54 mm Pitch 28 Way Surface DIP IC Socket
- TE Connectivity Through Hole Standard Pin Closed Frame IC Dip Socket, 3A
- TE Connectivity 2.54 mm Pitch 28 Way DIP Surface Test IC Socket