TE Connectivity 1.02mm Pitch SMT IC Socket

The TE Connectivity Socket assembly is expertly crafted for LGA 2011 applications, providing superior durability with a gold-plated contact mating area. This component is designed to ensure seamless signal integrity while effectively dissipating heat, making it an optimal choice for high-performance computing environments. The combination of high-temperature thermoplastic housing and finely tuned specifications ensures that this product meets the rigorous demands of modern electronic designs. Emphasising reliability, it features a square frame style for secure mounting, positioning it as an essential element in advanced circuit applications. Enhanced by a surface mount solder ball termination method, this product guarantees exceptional connections to printed circuit boards, paving the way for robust and efficient operational capabilities.

Designed to support advanced LGA 2011 socket connections
Utilises gold (Au) for contact mating area plating, enhancing conductivity
Constructed from high-temperature thermoplastic for superior durability
Facilitates reliable board-to-board connectivity with optimal grid spacing
Maintenance of signal integrity allows for better performance in high-speed applications
Low halogen content ensures compliance with environmental regulations
Allows for reflow solder capability up to 260°C, aiding manufacturing flexibility