TE Connectivity 1.02 mm Pitch 2011 Way Board IC Socket
- N° de stock RS:
- 468-903
- Numéro d'article Distrelec:
- 304-59-463
- Référence fabricant:
- 2174988-2
- Fabricant:
- TE Connectivity
Sous-total (8 unités, dans un pack de 8)*
218,16 €
(TVA exclue)
263,97 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Stocké-e par le fabricant
- Prêt à être expédié à partir du 09 novembre 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Paquet(s) | le paquet | Prix par unité* |
|---|---|---|
| 1 + | 218,16 € | 27,27 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 468-903
- Numéro d'article Distrelec:
- 304-59-463
- Référence fabricant:
- 2174988-2
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Product Type | IC Socket | |
| Number of Contacts | 2011 | |
| Current | 500mA | |
| Pitch | 1.02mm | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Socket Mount Type | Board | |
| Row Pitch | 1.02mm | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 260°C | |
| Standards/Approvals | EU ELV Directive 2000/53/EC Compliant, UL 94V-0, China RoHS 2 Directive MIIT Order No 32, EU REACH Regulation (EC) No. 1907/2006, EU RoHS Directive 2011/65/EU Compliant | |
| Housing Material | High Temperature Thermoplastic | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Product Type IC Socket | ||
Number of Contacts 2011 | ||
Current 500mA | ||
Pitch 1.02mm | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Socket Mount Type Board | ||
Row Pitch 1.02mm | ||
Termination Type Solder | ||
Maximum Operating Temperature 260°C | ||
Standards/Approvals EU ELV Directive 2000/53/EC Compliant, UL 94V-0, China RoHS 2 Directive MIIT Order No 32, EU REACH Regulation (EC) No. 1907/2006, EU RoHS Directive 2011/65/EU Compliant | ||
Housing Material High Temperature Thermoplastic | ||
- Pays d'origine :
- CN
The TE Connectivity Socket assembly is expertly crafted for LGA 2011 applications, providing superior durability with a gold-plated contact mating area. This component is designed to ensure seamless signal integrity while effectively dissipating heat, making it an optimal choice for high-performance computing environments. The combination of high-temperature thermoplastic housing and finely tuned specifications ensures that this product meets the rigorous demands of modern electronic designs. Emphasising reliability, it features a square frame style for secure mounting, positioning it as an essential element in advanced circuit applications. Enhanced by a surface mount solder ball termination method, this product guarantees exceptional connections to printed circuit boards, paving the way for robust and efficient operational capabilities.
Designed to support advanced LGA 2011 socket connections
Utilises gold (Au) for contact mating area plating, enhancing conductivity
Constructed from high-temperature thermoplastic for superior durability
Facilitates reliable board-to-board connectivity with optimal grid spacing
Maintenance of signal integrity allows for better performance in high-speed applications
Low halogen content ensures compliance with environmental regulations
Allows for reflow solder capability up to 260°C, aiding manufacturing flexibility
Liens connexes
- TE Connectivity 1.02 mm Pitch 2011 Way Board IC Socket
- Molex 1.02 mm Pitch 2011 Way Tray Surface LGA 7529 IC Socket
- TE Connectivity 1.02 mm Pitch 30 Way Surface IC Socket
- TE Connectivity 0.99 mm Pitch 3647 Way Board IC Socket
- TE Connectivity 2097 Way Board IC Socket
- TE Connectivity 2.54 mm Pitch 16 Way DIP Board IC Socket
- TE Connectivity 2.54 mm Pitch 20 Way Board DIP IC Socket
- TE Connectivity 2.54 mm Pitch 22 Way Board DIP IC Socket