TE Connectivity 1.02 mm Pitch 2011 Way Board IC Socket

Voir l’ensemble des IC Sockets

Sous-total (1 paquet de 8 unités)*

198,34 €

(TVA exclue)

239,99 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 03 avril 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Paquet(s)
le paquet
Prix par unité*
1 +198,34 €24,793 €

*Prix donné à titre indicatif

N° de stock RS:
468-903
Numéro d'article Distrelec:
304-59-463
Référence fabricant:
2174988-2
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Product Type

IC Socket

Number of Contacts

2011

Current

0.5A

Pitch

1.02mm

Contact Material

Copper Alloy

Contact Plating

Gold

Socket Mount Type

Board

Termination Type

Solder

Row Pitch

1.02mm

Maximum Operating Temperature

260°C

Standards/Approvals

EU ELV Directive 2000/53/EC Compliant, UL 94V-0, China RoHS 2 Directive MIIT Order No 32, EU REACH Regulation (EC) No. 1907/2006, EU RoHS Directive 2011/65/EU Compliant

Housing Material

High Temperature Thermoplastic

Pays d'origine :
CN
The TE Connectivity Socket assembly is expertly crafted for LGA 2011 applications, providing superior durability with a gold-plated contact mating area. This component is designed to ensure seamless signal integrity while effectively dissipating heat, making it an optimal choice for high-performance computing environments. The combination of high-temperature thermoplastic housing and finely tuned specifications ensures that this product meets the rigorous demands of modern electronic designs. Emphasising reliability, it features a square frame style for secure mounting, positioning it as an essential element in advanced circuit applications. Enhanced by a surface mount solder ball termination method, this product guarantees exceptional connections to printed circuit boards, paving the way for robust and efficient operational capabilities.

Designed to support advanced LGA 2011 socket connections

Utilises gold (Au) for contact mating area plating, enhancing conductivity

Constructed from high-temperature thermoplastic for superior durability

Facilitates reliable board-to-board connectivity with optimal grid spacing

Maintenance of signal integrity allows for better performance in high-speed applications

Low halogen content ensures compliance with environmental regulations

Allows for reflow solder capability up to 260°C, aiding manufacturing flexibility

Liens connexes