TE Connectivity 2.54 mm Pitch 40 Way Board DIP IC Socket
- N° de stock RS:
- 679-073
- Référence fabricant:
- 7-1437536-3
- Fabricant:
- TE Connectivity
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
- N° de stock RS:
- 679-073
- Référence fabricant:
- 7-1437536-3
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| IC Socket Type | DIP | |
| Product Type | IC Socket | |
| Number of Contacts | 40 | |
| Current | 3A | |
| Number of Rows | 2 | |
| Pitch | 2.54mm | |
| Orientation | Vertical | |
| Contact Material | Beryllium Copper | |
| Contact Plating | Gold | |
| Row Pitch | 15.24mm | |
| Termination Type | Through Hole | |
| Socket Mount Type | Board | |
| Minimum Operating Temperature | -55°C | |
| Device Mount Type | Board | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | UL | |
| Series | 500 Series | |
| Housing Material | Polyester | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
IC Socket Type DIP | ||
Product Type IC Socket | ||
Number of Contacts 40 | ||
Current 3A | ||
Number of Rows 2 | ||
Pitch 2.54mm | ||
Orientation Vertical | ||
Contact Material Beryllium Copper | ||
Contact Plating Gold | ||
Row Pitch 15.24mm | ||
Termination Type Through Hole | ||
Socket Mount Type Board | ||
Minimum Operating Temperature -55°C | ||
Device Mount Type Board | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals UL | ||
Series 500 Series | ||
Housing Material Polyester | ||
- Pays d'origine :
- CH
The TE Connectivity Socket Assembly features 40 positions with a standard connector profile and a 15.24 mm row-to-row spacing. The contacts are stamped and formed, with gold (Au) plating on the mating area for enhanced conductivity and corrosion resistance. Ideal for high-performance applications requiring Durable and reliable electrical connections.
Mating contact type is four-fingered
Contact base material is beryllium copper
PCB contact termination area plating material is gold
Contact fabrication is stamped & formed
Contact mating area plating material is gold
Liens connexes
- TE Connectivity 2.54 mm Pitch 24 Way Board DIP IC Socket
- TE Connectivity 2.54 mm Pitch 20 Way DIP Through Hole DIP IC Socket
- TE Connectivity 2.54 mm Pitch 20 Way DIP Board DIP IC Socket
- TE Connectivity 2.54 mm Pitch 20 Way Board DIP IC Socket
- TE Connectivity 2.54 mm Pitch 16 Way DIP Board IC Socket
- TE Connectivity 2.54 mm Pitch 40 Way DIP IC Socket
- TE Connectivity Through Hole Standard Pin Closed Frame IC Dip Socket, 3A
- TE Connectivity 2.54 mm Pitch 14 Way Through Hole DIP IC Socket