TE Connectivity 1.02 mm Pitch 30 Way IC Socket
- N° de stock RS:
- 480-344
- Numéro d'article Distrelec:
- 304-57-867
- Référence fabricant:
- 1-1554653-1
- Fabricant:
- TE Connectivity
Sous-total (1 plateau de 6 unités)*
248,96 €
(TVA exclue)
301,24 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 03 avril 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Plateau(x) | le plateau | Prix par unité* |
|---|---|---|
| 1 + | 248,96 € | 41,493 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 480-344
- Numéro d'article Distrelec:
- 304-57-867
- Référence fabricant:
- 1-1554653-1
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Product Type | IC Socket | |
| Number of Contacts | 30 | |
| Current | 0.5A | |
| Pitch | 1.02mm | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Termination Type | Solder | |
| Device Mount Type | Board | |
| Row Pitch | 1.02mm | |
| Maximum Operating Temperature | 260°C | |
| Standards/Approvals | EU RoHS 2011/65/EU, China RoHS 2 MIIT Order No 32, EU ELV 2000/53/EC, UL 94V-0, 2016 | |
| Housing Material | High Temperature Thermoplastic | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Product Type IC Socket | ||
Number of Contacts 30 | ||
Current 0.5A | ||
Pitch 1.02mm | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Termination Type Solder | ||
Device Mount Type Board | ||
Row Pitch 1.02mm | ||
Maximum Operating Temperature 260°C | ||
Standards/Approvals EU RoHS 2011/65/EU, China RoHS 2 MIIT Order No 32, EU ELV 2000/53/EC, UL 94V-0, 2016 | ||
Housing Material High Temperature Thermoplastic | ||
- Pays d'origine :
- CN
The TE Connectivity SOCKET ASSY LGA2011 is engineered to provide exceptional connectivity for high-performance applications. This advanced IC socket is specifically designed to accommodate devices with 2011 positions within a compact and robust structure. With its surface mount solder ball termination method, it ensures reliable operation in demanding environments. The socket's square frame design enhances stability while the high-temperature thermoplastic housing material guarantees durability. It is particularly ideal for configurations requiring a high pin count, making it an essential component in modern electronic systems. Additionally, compliance with industry standards such as UL 94V-0 reinforces its credibility and safety for diverse applications.
Optimised for high performance applications requiring 2011 positions
Durable construction using high temperature thermoplastic material
Square frame design elevates stability and ease of integration
Surface mount technology enables compact PCB layouts
Gold plated contact area ensures superior electrical conductivity
Low halogen materials contribute to environmentally friendly manufacturing
Reflow solder capability supports efficient assembly processes
Compliant with EU RoHS and REACH regulations
Versatile application in board to board configurations
Liens connexes
- TE Connectivity 1.02 mm Pitch 2011 Way Board IC Socket
- TE Connectivity 2.54 mm Pitch 10 Way IC Socket
- TE Connectivity 1 mm Pitch 8 Way Transistor IC Socket
- TE Connectivity 2.54 mm Pitch 14 Way DIP IC Socket
- TE Connectivity 2.54 mm Pitch 40 Way Transistor IC Socket
- TE Connectivity 0.75 mm Pitch 20 Way SIP IC Socket
- TE Connectivity 2 mm Pitch 10 Way Transistor IC Socket
- TE Connectivity 2.54 mm Pitch 10 Way Through Hole SIP Socket IC Socket