TE Connectivity 1.02mm Pitch 30 Way SMT IC Socket
- N° de stock RS:
- 480-344
- Référence fabricant:
- 1-1554653-1
- Fabricant:
- TE Connectivity
Sous-total (1 plateau de 6 unités)*
248,96 €
(TVA exclue)
301,24 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 03 février 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Plateau(x) | le plateau | Prix par unité* |
|---|---|---|
| 1 + | 248,96 € | 41,493 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 480-344
- Référence fabricant:
- 1-1554653-1
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Gender | Socket | |
| Number of Contacts | 30 | |
| Pitch | 1.02mm | |
| Socket Mounting Type | Surface Mount | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Gender Socket | ||
Number of Contacts 30 | ||
Pitch 1.02mm | ||
Socket Mounting Type Surface Mount | ||
- Pays d'origine :
- CN
The TE Connectivity SOCKET ASSY LGA2011 is engineered to provide exceptional connectivity for high-performance applications. This advanced IC socket is specifically designed to accommodate devices with 2011 positions within a compact and robust structure. With its surface mount solder ball termination method, it ensures reliable operation in demanding environments. The socket's square frame design enhances stability while the high-temperature thermoplastic housing material guarantees durability. It is particularly ideal for configurations requiring a high pin count, making it an essential component in modern electronic systems. Additionally, compliance with industry standards such as UL 94V-0 reinforces its credibility and safety for diverse applications.
Optimised for high performance applications requiring 2011 positions
Durable construction using high temperature thermoplastic material
Square frame design elevates stability and ease of integration
Surface mount technology enables compact PCB layouts
Gold plated contact area ensures superior electrical conductivity
Low halogen materials contribute to environmentally friendly manufacturing
Reflow solder capability supports efficient assembly processes
Compliant with EU RoHS and REACH regulations
Versatile application in board to board configurations
Durable construction using high temperature thermoplastic material
Square frame design elevates stability and ease of integration
Surface mount technology enables compact PCB layouts
Gold plated contact area ensures superior electrical conductivity
Low halogen materials contribute to environmentally friendly manufacturing
Reflow solder capability supports efficient assembly processes
Compliant with EU RoHS and REACH regulations
Versatile application in board to board configurations
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