TE Connectivity 2.54mm Pitch 16 Way Through Hole DIP IC Socket
- N° de stock RS:
- 478-503
- Référence fabricant:
- 2-1437539-8
- Fabricant:
- TE Connectivity
Sous-total (1 paquet de 120 unités)*
229,92 €
(TVA exclue)
278,20 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 10 février 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Paquet(s) | le paquet | Prix par unité* |
|---|---|---|
| 1 + | 229,92 € | 1,916 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 478-503
- Référence fabricant:
- 2-1437539-8
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Package Type | DIP | |
| Number of Contacts | 16 | |
| Number of Rows | 2 | |
| Pitch | 2.54mm | |
| Socket Mounting Type | Through Hole | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Package Type DIP | ||
Number of Contacts 16 | ||
Number of Rows 2 | ||
Pitch 2.54mm | ||
Socket Mounting Type Through Hole | ||
Non conforme
- Pays d'origine :
- CH
The TE Connectivity Socket assembly is a highly efficient and reliable DIP socket designed for seamless integration with printed circuit boards. Engineered to accommodate 16 positions, this standard socket offers optimal performance in various electronic applications. Its robust open frame style facilitates easy insertion and removal of ICs, while the stamped and formed contact fabrication ensures a strong electrical connection. The combination of gold plating on the contact mating area enhances durability and conductance, making this socket ideal for demanding environments. With a vertical PCB mount orientation, this component is well-suited for space-constrained designs, ensuring that you can maximise functionality without compromising on device footprint.
Designed for standard, stamped and formed applications
Features gold plating for superior conductivity and durability
Offers easy integration with vertical PCB mount orientation
Optimised for 16 positions to support multiple applications
Provides reliable wave soldering capabilities
Facilitates enhanced electrical performance in various environments
Streamlined open frame design allows for quick IC changes
Supports widespread usage across various electronic manufacturing sectors
Features gold plating for superior conductivity and durability
Offers easy integration with vertical PCB mount orientation
Optimised for 16 positions to support multiple applications
Provides reliable wave soldering capabilities
Facilitates enhanced electrical performance in various environments
Streamlined open frame design allows for quick IC changes
Supports widespread usage across various electronic manufacturing sectors
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