Vishay E Type N-Channel Power MOSFET, 51 A, 600 V Enhancement, 8-Pin 8x8LR

Sous-total (1 bobine de 3000 unités)*

9 972,00 €

(TVA exclue)

12 066,00 €

(TVA incluse)

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  • Expédition à partir du 04 décembre 2026
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Prix par unité
la bobine*
3000 +3,324 €9 972,00 €

*Prix donné à titre indicatif

N° de stock RS:
279-9928
Référence fabricant:
SIHR080N60E-T1-GE3
Fabricant:
Vishay
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Marque

Vishay

Product Type

Power MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

51A

Maximum Drain Source Voltage Vds

600V

Package Type

8x8LR

Series

E

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

0.084Ω

Channel Mode

Enhancement

Maximum Power Dissipation Pd

500W

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

63nC

Forward Voltage Vf

1.2V

Maximum Gate Source Voltage Vgs

30V

Maximum Operating Temperature

150°C

Length

8mm

Standards/Approvals

RoHS

Automotive Standard

No

Vishay Series E Power MOSFET, 600V Drain Source Voltage, 51A Maximum Continuous Drain Current - SIHR080N60E-T1-GE3


This power MOSFET is a high-voltage switching device designed for demanding industrial electronics and power systems. It operates as an enhancement-mode N-channel transistor tailored for surface-mount installation and delivers robust performance for high-voltage applications while remaining suitable for environments that require compact, board-mounted power components.

Features and Benefits:


• 600V drain capability for high-voltage switching
• 51A continuous current handling for heavy loads
• 0.084Ω low Rds(on) to reduce conduction losses
• 500W power dissipation for thermal headroom
• 63nC typical gate charge for predictable switching behaviour
• 30V gate maximum to accommodate common drive voltages

Applications


• Suitable for industrial motor drive inverter stages
• Ideal for high-voltage power supplies and converters
• Used for DC-DC conversion in automation equipment
• Can be used for switching stages in power management systems
• Used with high-temperature assemblies in harsh environments

What temperature range can the device tolerate during operation?


It is rated to function from -55°C up to 150°C, enabling use in systems exposed to wide thermal variations.

How is the device packaged for PCB assembly?


It is supplied in a surface-mount 8x8LR package with eight pins to support Compact PCB layouts and automated placement.

What gate drive considerations should be observed?


The gate must not exceed ±30V

designers should ensure drive circuits limit Vgs within this threshold to prevent gate damage.

How does switching behaviour impact thermal management?


Typical gate charge of 63nC influences switching losses and therefore affects heat generation during high-frequency operation, informing heatsink or PCB copper requirements.

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