Infineon HEXFET N-Channel MOSFET, 124 A, 100 V Enhancement DirectFET IRF7769L1TRPBF

Sous-total (1 bobine de 4000 unités)*

9 796,00 €

(TVA exclue)

11 852,00 €

(TVA incluse)

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  • Expédition à partir du 22 mars 2027
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Unité
Prix par unité
la bobine*
4000 +2,449 €9 796,00 €

*Prix donné à titre indicatif

N° de stock RS:
257-9317
Référence fabricant:
IRF7769L1TRPBF
Fabricant:
Infineon
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Marque

Infineon

Channel Type

N

Product Type

MOSFET

Maximum Continuous Drain Current Id

124A

Maximum Drain Source Voltage Vds

100V

Series

HEXFET

Package Type

DirectFET

Mount Type

Through Hole

Maximum Drain Source Resistance Rds

3.50mΩ

Channel Mode

Enhancement

Minimum Operating Temperature

-55°C

Forward Voltage Vf

1.3V

Maximum Operating Temperature

+175°C

Standards/Approvals

RoHS

Automotive Standard

No

Infineon HEXFET Series MOSFET, 100V Maximum Drain-Source Voltage, 124A Maximum Continuous Drain Current - IRF7769L1TRPBF


This MOSFET is a through‑hole N‑channel enhancement device designed for high‑current switching in demanding electrical systems. It operates across a wide temperature range suitable for industrial conditions and meets RoHS environmental restrictions. The component is supplied in a DirectFET package intended for applications requiring efficient thermal management and Compact board integration.

Features and Benefits:


• 3.50mΩ RDS(on) reduces conduction losses for higher efficiency
• 100V VDS enables operation in medium‑voltage topologies
• 124A continuous drain current supports high‑power delivery
• VF 1.3V forward voltage assists accurate gate‑to‑source control
• -55°C to +175°C temperature range ensures extended thermal tolerance

Applications


• Suitable for power supply and motor control systems
• Used with high‑current DC power distribution racks
• Ideal for industrial converter and inverter stages
• Can be used for battery management and charge regulation

What package type is used for thermal handling?


It uses a DirectFET package to facilitate low thermal resistance and efficient heat transfer.

Which mounting method does it require?


The device is designed for through‑hole mounting to provide robust mechanical and thermal connection.

Is the device suited to automotive qualifications?


It is not specified as an automotive‑standard part and therefore should be evaluated against vehicle‑specific requirements.

What channel polarity and mode are implemented?


The part is an N‑channel device operating in enhancement mode, suitable for common high‑side or low‑side switches.

Does the component comply with environmental directives?


It is RoHS‑compliant, indicating restriction of certain hazardous substances.

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