Vishay SIZ260DT Type N-Channel MOSFET, 8.9 A, 80 V, 8-Pin PowerPAIR 3 x 3S SIZ260DT-T1-GE3

Sous-total (1 bobine de 3000 unités)*

1 725,00 €

(TVA exclue)

2 088,00 €

(TVA incluse)

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  • Expédition à partir du 14 décembre 2026
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la bobine*
3000 +0,575 €1 725,00 €

*Prix donné à titre indicatif

N° de stock RS:
256-7436
Référence fabricant:
SIZ260DT-T1-GE3
Fabricant:
Vishay
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Marque

Vishay

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

8.9A

Maximum Drain Source Voltage Vds

80V

Series

SIZ260DT

Package Type

PowerPAIR 3 x 3S

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

0.0247Ω

Forward Voltage Vf

1.2V

Maximum Gate Source Voltage Vgs

20V

Maximum Power Dissipation Pd

33W

Typical Gate Charge Qg @ Vgs

6.3nC

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

150°C

Length

3.3mm

Width

3.3mm

Standards/Approvals

RoHS

Automotive Standard

No

Vishay SIZ260DT Series MOSFET, 33W Maximum Power Dissipation, 80V Maximum Drain Source Voltage - SIZ260DT-T1-GE3


This MOSFET is a surface-mount N-channel transistor designed for power switching in compact electronics. It operates across a wide temperature span and is suitable for applications requiring moderate voltage handling and high continuous current capability. The device is RoHS compliant and supplied in a compact PowerPAIR 3x3S package for dense board layouts.

Features and Benefits:


• 80V drain-source rating enables medium-voltage switching
• 8.9A continuous drain current supports high-load circuits
• 0.0247Ω Rds(on) reduces conduction losses for efficiency
• 6.3nC typical gate charge allows faster gate-drive response
• 33W maximum power dissipation manages thermal stress
• 20V gate-source limit provides wide gate-drive margin

Applications


• Suitable for DC-DC converter switching stages
• Used for motor drive half-bridge configurations
• Ideal for power management in telecoms equipment
• Can be used for synchronous rectification in SMPS
• Suitable for high-current load switches on compact boards

What package footprint should I allow for mounting?


The device is supplied in a PowerPAIR 3x3S surface-mount package with a nominal 3.3mmx3.3mm footprint and eight pins, so design pads must match that compact outline.

How does it behave across temperature extremes?


It is specified to operate from -55°C up to +150°C, maintaining conduction and switching characteristics within that temperature range.

What gate drive constraints must be observed?


The maximum permissible gate-source voltage is 20V

gate-drive circuits should be designed to keep Vgs within this limit to prevent device stress.

How should thermal management be considered in designs?


With a 33W maximum power dissipation, adequate PCB copper, thermal vias or heatsinking should be incorporated to keep junction temperature within safe limits.

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