Infineon IPT N-Channel MOSFET, 333 A, 80 V, 8-Pin HSOF-8 IPT013N08NM5LFATMA1

Sous-total (1 bobine de 2000 unités)*

9 328,00 €

(TVA exclue)

11 286,00 €

(TVA incluse)

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  • Expédition à partir du 11 janvier 2027
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Unité
Prix par unité
la bobine*
2000 +4,664 €9 328,00 €

*Prix donné à titre indicatif

N° de stock RS:
236-1586
Référence fabricant:
IPT013N08NM5LFATMA1
Fabricant:
Infineon
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Marque

Infineon

Channel Type

N

Product Type

MOSFET

Maximum Continuous Drain Current Id

333A

Maximum Drain Source Voltage Vds

80V

Series

IPT

Package Type

HSOF-8

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

1.3mΩ

Maximum Power Dissipation Pd

278W

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

158nC

Forward Voltage Vf

1V

Maximum Gate Source Voltage Vgs

20V

Maximum Operating Temperature

150°C

Width

10.58mm

Length

10.1mm

Standards/Approvals

No

Height

2.4mm

Automotive Standard

No

Infineon IPT Series MOSFET, 80V Maximum Drain Source Voltage, 333A Maximum Continuous Drain Current - IPT013N08NM5LFATMA1


This MOSFET is a high-current N-channel transistor designed for surface-mount power switching in demanding thermal environments. It operates across a wide ambient range and delivers substantial continuous drain current and voltage capability for industrial and power-conversion applications.

Features and Benefits:


• 333A continuous drain current for heavy load handling
• 80V drain-to-source rating for mid-voltage systems
• 1.3mΩ low Rds(on) to reduce conduction losses
• 278W maximum power dissipation for thermal headroom
• 158nC typical gate charge for predictable switching behaviour

Applications


• Suitable for high-current DC-DC converters
• Ideal for motor drives and traction inverters
• Used with power distribution modules in servers
• Can be used for high-power battery management systems

What gate voltage range is permissible for driving this device?


The gate can be driven up to 20V relative to source without exceeding the specified limit.

What package and mounting style does it use for assembly?


It is supplied in an HSOF-8 package configured for surface mounting on printed-circuit assemblies.

How does the device perform in low-temperature conditions?


It is rated to operate down to -55°C, allowing use in cold-climate installations.

What are the physical envelope measurements relevant for PCB footprint planning?


The component measures 10.1mm by 10.58mm with a height of 2.4mm.

Is this device specified to meet automotive-grade standards?


It is not classified as an automotive-grade component.

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