Infineon 600V CoolMOS P7 Type N-Channel MOSFET, 9 A, 600 V Enhancement, 3-Pin TO-252 IPD60R360P7ATMA1

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9,795 €

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11,85 €

(TVA incluse)

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15 +0,653 €9,80 €

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N° de stock RS:
214-4388
Référence fabricant:
IPD60R360P7ATMA1
Fabricant:
Infineon
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Marque

Infineon

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

9A

Maximum Drain Source Voltage Vds

600V

Series

600V CoolMOS P7

Package Type

TO-252

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

360mΩ

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

13nC

Forward Voltage Vf

0.9V

Maximum Power Dissipation Pd

41W

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

150°C

Standards/Approvals

No

Length

6.65mm

Height

2.35mm

Automotive Standard

No

Infineon 600V CoolMOS P7 Series MOSFET, 600V Drain Source Voltage, 9A Continuous Drain Current - IPD60R360P7ATMA1


This MOSFET is a high-voltage N-channel switching transistor designed for surface-mounted power conversion and switching applications. It operates across a wide temperature span suitable for demanding environments and is intended to handle high drain-to-source voltages while providing controlled conduction and switching behaviour in power supplies and related circuits.

Features and Benefits:


• 600V maximum drain-to-source voltage enables high-voltage designs
• 9A continuous drain current supports substantial load capability
• 360mΩ Rds(on) limits conduction losses at operating currents
• 13nC typical gate charge reduces switching energy and stress
• 20V maximum gate-to-source withstands robust drive margins
• 41W power dissipation allows significant thermal loading

Applications


• Suitable for offline switch-mode power supplies
• Ideal for high-voltage DC-DC converters
• Used with bridge and clamped switching topologies
• Can be used for industrial motor-drive front ends
• Appropriate for telecom power distribution modules

What packaging and mounting considerations should I plan for?


It is supplied in a TO-252 package intended for surface-mount assembly

ensure an appropriate land pattern and thermal vias if board-level heat spreading is required.

How does thermal range affect deployment?


The device is specified to operate from -55°C up to 150°C so it can be used in environments with extreme temperature variations without derating for ambient extremes within that range.

What gate-drive constraints apply during layout?


Keep gate leads short to minimise inductance given the 13nC gate charge and respect the ±20V gate-to-source absolute limit during drive and transient conditions.

How should I assess current capability in my design?


Use the 9A continuous drain current rating as a baseline and verify system-level thermal resistance and cooling to maintain junction temperatures within the specified limits.

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