Vishay Isolated TrenchFET 2 Type P-Channel Power MOSFET, 2.3 A, 30 V Enhancement, 6-Pin TSOP SI3993CDV-T1-GE3

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492,00 €

(TVA exclue)

594,00 €

(TVA incluse)

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  • Expédition à partir du 14 décembre 2026
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3000 +0,164 €492,00 €

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N° de stock RS:
165-6919
Référence fabricant:
SI3993CDV-T1-GE3
Fabricant:
Vishay
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Marque

Vishay

Channel Type

Type P

Product Type

Power MOSFET

Maximum Continuous Drain Current Id

2.3A

Maximum Drain Source Voltage Vds

30V

Package Type

TSOP

Series

TrenchFET

Mount Type

Surface

Pin Count

6

Maximum Drain Source Resistance Rds

188mΩ

Channel Mode

Enhancement

Maximum Gate Source Voltage Vgs

20V

Typical Gate Charge Qg @ Vgs

5.2nC

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

1.4W

Maximum Operating Temperature

150°C

Transistor Configuration

Isolated

Standards/Approvals

No

Height

1mm

Width

1.7mm

Length

3.1mm

Number of Elements per Chip

2

Automotive Standard

No

Pays d'origine :
CN

Vishay TrenchFET Series Power MOSFET, 30V Drain Source Voltage, 2.3A Continuous Drain Current - SI3993CDV-T1-GE3


This power MOSFET is a surface-mount P-channel transistor designed for switching and load-management roles in compact electronic assemblies. It provides an isolated transistor configuration in a low-profile TSOP package and is intended for applications requiring moderate current handling and controlled gate drive within a 30V voltage environment.

Features and Benefits:


• P-channel enhancement mode enables simple high-side switching
• Peak continuous drain current 2.3A supports moderate loads
• Low Rds(on) at 188mΩ reduces conduction losses
• Typical gate charge 5.2nC enables fast gate transitions
• Maximum power dissipation 1.4W manages thermal load in small boards
• Six-pin surface-mount package allows compact PCB placement

Applications


• Suitable for battery-powered high-side switching circuits
• Ideal for DC load disconnect and reverse-current blocking
• Used with power-management modules in consumer devices
• Can be used for level-shifted gate control in compact assemblies

What gate drive constraints should I consider?


The device accepts up to ±20V between gate and source, so gate-drive circuitry must keep Vgs within that range to prevent gate stress.

How tolerant is it to temperature extremes during operation?


It operates across a wide temperature span from -55°C to 150°C, permitting use in environments with severe thermal variation.

How many transistor elements does the die include and what is the package pin count?


The chip integrates two elements and the package presents six pins for board connections.

What is the maximum drain-source voltage and how does that influence circuit design?


The MOSFET is rated to 30V between drain and source, so it should be used where supply rails and transient conditions remain below that threshold.

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