Vishay EF Type N-Channel Power MOSFET, 8 A, 800 V Enhancement, 3-Pin TO-220AB

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2,50 €

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3,02 €

(TVA incluse)

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*Prix donné à titre indicatif

N° de stock RS:
653-140
Référence fabricant:
SIHP11N80AEF-GE3
Fabricant:
Vishay
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Marque

Vishay

Channel Type

Type N

Product Type

Power MOSFET

Maximum Continuous Drain Current Id

8A

Maximum Drain Source Voltage Vds

800V

Series

EF

Package Type

TO-220AB

Mount Type

Through Hole

Pin Count

3

Maximum Drain Source Resistance Rds

0.483Ω

Channel Mode

Enhancement

Forward Voltage Vf

1.2V

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

27nC

Maximum Gate Source Voltage Vgs

30V

Maximum Power Dissipation Pd

78W

Maximum Operating Temperature

150°C

Standards/Approvals

RoHS

Automotive Standard

No

Vishay Series EF Power MOSFET, 800V Drain Source Voltage, 8A Continuous Drain Current - SIHP11N80AEF-GE3


This power MOSFET is a high-voltage switching device designed for use in industrial power conversion and control systems. It operates as an N‑channel enhancement‑mode transistor in a through‑hole TO‑220AB package, providing a practical option for engineers requiring a discrete component for board‑level mounting and thermal management in demanding environments.

Features and Benefits:


• 800V drain rating enabling high-voltage switching applications • 8A continuous drain current supporting moderate load currents • Rds(on) 0.483Ω reducing conduction losses under load • 78W power dissipation for effective thermal handling • 27nC typical gate charge for predictable switching dynamics • 150°C maximum operating temperature for elevated-temperature use

Applications


• Suitable for industrial motor drive front-ends handling high voltage • Ideal for power supplies requiring high-voltage switching elements • Used for inverter stages in medium-power electrical systems • Can be used for brake and snubber circuits in automation equipment

What gate voltage range should be observed for safe operation?


The device requires gate excursions within ±30V maximum relative to its source to avoid gate over‑stress.

How does the package affect thermal management on a populated board?


The TO‑220AB through‑hole format allows direct heatsinking to the rear tab, improving conduction to an external heatsink and aiding removal of 78W of dissipated power under appropriate cooling.

What ambient conditions limit its deployment?


The component is specified to operate down to -55°C and up to 150°C junction temperature

system thermal design must ensure junction temperatures remain below the 150°C limit.

What switching consideration arises from the gate charge figure?


A typical gate charge of 27nC lets designers estimate drive current requirements and switching losses when selecting a gate driver and predicting turn‑on/turn‑off timing.

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