Infineon OptiMOS Type N-Channel MOSFET, 18 A, 600 V Enhancement, 3-Pin PG-TO252-3 IPD60R180CM8XTMA1

Offre groupée disponible

Sous-total (1 paquet de 5 unités)*

8,30 €

(TVA exclue)

10,05 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
En stock
  • Plus 2 500 unité(s) expédiée(s) à partir du 29 décembre 2025
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité
Prix par unité
le paquet*
5 - 451,66 €8,30 €
50 - 951,578 €7,89 €
100 - 4951,46 €7,30 €
500 - 9951,346 €6,73 €
1000 +1,296 €6,48 €

*Prix donné à titre indicatif

N° de stock RS:
348-988
Référence fabricant:
IPD60R180CM8XTMA1
Fabricant:
Infineon
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

Infineon

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

18A

Maximum Drain Source Voltage Vds

600V

Series

OptiMOS

Package Type

PG-TO252-3

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

0.18Ω

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

17nC

Maximum Power Dissipation Pd

127W

Maximum Gate Source Voltage Vgs

20 V

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

150°C

Standards/Approvals

RoHS

Automotive Standard

No

Pays d'origine :
MY
The Infineon CoolMOS 8th generation platform is a revolutionary technology for high voltage power MOSFETs, designed according to the super junction(SJ) principle and pioneered by Infineon Technologies. The 600V CoolMOS CM8 series is the successor to the CoolMOS 7. It combines the benefits of a fast switching SJ MOSFET with excellent ease of use, e.g low ringing tendency, implemented fast body diode for all products with outstanding robustness against hard commutation and excellent ESD capability. Furthermore, extremely low switching and conduction losses of CM8, make switching applications even more efficient.

Suitable for hard and soft switching topologies

Ease of use and fast design in through low ringing tendency

Simplified thermal management thanks to our advanced die attach technique

Suitable for a wide variety of applications and power ranges

Increased power density solutions enabled by using products with smaller footprint

Liens connexes