TE Connectivity 2.54 mm Pitch 16 Way DIP DIP IC Socket
- N° de stock RS:
- 477-279
- Numéro d'article Distrelec:
- 304-63-553
- Référence fabricant:
- 4-1437537-0
- Fabricant:
- TE Connectivity
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
- N° de stock RS:
- 477-279
- Numéro d'article Distrelec:
- 304-63-553
- Référence fabricant:
- 4-1437537-0
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| IC Socket Type | DIP | |
| Package Type | DIP | |
| Product Type | IC Socket | |
| Number of Contacts | 16 | |
| Current | 3A | |
| Number of Rows | 2 | |
| Pitch | 2.54mm | |
| Orientation | Vertical | |
| Contact Material | Beryllium Copper Alloy | |
| Contact Plating | Gold | |
| Row Pitch | 2.54mm | |
| Termination Type | Solder | |
| Device Mount Type | Board | |
| Maximum Operating Temperature | 265°C | |
| Standards/Approvals | UL 94 V-0 | |
| Housing Material | Polyester | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
IC Socket Type DIP | ||
Package Type DIP | ||
Product Type IC Socket | ||
Number of Contacts 16 | ||
Current 3A | ||
Number of Rows 2 | ||
Pitch 2.54mm | ||
Orientation Vertical | ||
Contact Material Beryllium Copper Alloy | ||
Contact Plating Gold | ||
Row Pitch 2.54mm | ||
Termination Type Solder | ||
Device Mount Type Board | ||
Maximum Operating Temperature 265°C | ||
Standards/Approvals UL 94 V-0 | ||
Housing Material Polyester | ||
- Pays d'origine :
- CH
The TE Connectivity Socket assembly is engineered for precision and reliability, designed to excel in various electronic applications. This high-quality DIP socket features a robust build with a standard profile, making it suitable for seamless integration on printed circuit boards. Its compact dimensions enable efficient use of space while maintaining superior performance. With a unique four-fingered contact design, it guarantees optimal signal quality and minimal contact resistance. Additionally, the combination of premium materials ensures durability and longevity, making this socket assembly a trusted choice for professionals seeking dependable connectivity solutions.
Vertical PCB mount orientation maximises space efficiency
Standard, screw machine design simplifies installation
Gold plating on contacts ensures outstanding conductivity
Ten mΩ contact resistance enhances overall performance
Wave solder capability allows for easy assembly processes
Polarisation aids accurate mating and alignment
Designed for signal applications, optimising operational efficiency
Tin-Lead sleeve plating enhances corrosion resistance
Liens connexes
- TE Connectivity 2.54mm Pitch 8 Way SMT DIP Socket IC Socket
- TE Connectivity 2.54mm Pitch 16 Way Through Hole DIP IC Socket
- TE Connectivity 2.54mm Pitch 28 Way Through Hole DIP IC Socket
- TE Connectivity 2.54mm Pitch 20 Way Through Hole DIP IC Socket
- TE Connectivity 2.54mm Pitch 28 Way SMT DIP Test IC Socket
- TE Connectivity 2.54mm Pitch 20 Way SMT DIP Test IC Socket
- TE Connectivity 2.54mm Pitch 8 Way Through Hole DIP IC Socket
- TE Connectivity 2.54mm Pitch 18 Way SMT DIP Test IC Socket
