TE Connectivity 2.54 mm Pitch 8 Way DIP DIP IC Socket
- N° de stock RS:
- 477-528
- Numéro d'article Distrelec:
- 304-62-986
- Référence fabricant:
- 1437537-5
- Fabricant:
- TE Connectivity
Sous-total (1 paquet de 25 unités)*
237,31 €
(TVA exclue)
287,15 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 13 mars 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Paquet(s) | le paquet | Prix par unité* |
|---|---|---|
| 1 + | 237,31 € | 9,492 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 477-528
- Numéro d'article Distrelec:
- 304-62-986
- Référence fabricant:
- 1437537-5
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Package Type | DIP | |
| Product Type | IC Socket | |
| IC Socket Type | DIP | |
| Number of Contacts | 8 | |
| Current | 3A | |
| Number of Rows | 2 | |
| Pitch | 2.54mm | |
| Orientation | Vertical | |
| Contact Material | Beryllium Copper Alloy | |
| Contact Plating | Gold | |
| Termination Type | Solder | |
| Row Pitch | 2.54mm | |
| Device Mount Type | Board | |
| Maximum Operating Temperature | 265°C | |
| Series | 808-AG10D | |
| Standards/Approvals | UL 94 V-0 | |
| Housing Material | Polyester | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Package Type DIP | ||
Product Type IC Socket | ||
IC Socket Type DIP | ||
Number of Contacts 8 | ||
Current 3A | ||
Number of Rows 2 | ||
Pitch 2.54mm | ||
Orientation Vertical | ||
Contact Material Beryllium Copper Alloy | ||
Contact Plating Gold | ||
Termination Type Solder | ||
Row Pitch 2.54mm | ||
Device Mount Type Board | ||
Maximum Operating Temperature 265°C | ||
Series 808-AG10D | ||
Standards/Approvals UL 94 V-0 | ||
Housing Material Polyester | ||
- Pays d'origine :
- CH
The TE Connectivity DIP socket is designed for optimal circuit connectivity and reliability. Ideal for standard applications, the device features an open design that enables straightforward mounting and integration onto printed circuit boards. Constructed with durable materials, it incorporates advanced electrical characteristics, ensuring minimal contact resistance and maximum insulation. The socket accommodates various configurations, providing versatility for both industrial and consumer electronics. Whether for prototyping or production, this socket stands out with its rigorous compliance to international standards, ensuring product safety and longevity in any application.
Optimised for vertical PCB mount orientation
Employs a four-fingered mating contact type for secure connections
Features a tin-lead sleeve plating for enhanced durability
Constructed from brass sleeve material that withstands a range of operating conditions
Utilises a ladder open frame style for easy handling and installation
Designed to support wave solder processes with high-temperature resistance
Incorporates gold plating in contact areas for superior conductivity
Suitable for signal circuit applications, ensuring consistent performance
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