Vishay SI1427EDH Type P-Channel MOSFET, -2 A, -20 V, 6-Pin SC-70 SI1427EDH-T1-GE3

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4,70 €

(TVA exclue)

5,675 €

(TVA incluse)

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25 +0,188 €4,70 €

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N° de stock RS:
256-7341
Référence fabricant:
SI1427EDH-T1-GE3
Fabricant:
Vishay
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Marque

Vishay

Product Type

MOSFET

Channel Type

Type P

Maximum Continuous Drain Current Id

-2A

Maximum Drain Source Voltage Vds

-20V

Package Type

SC-70

Series

SI1427EDH

Mount Type

Surface

Pin Count

6

Maximum Drain Source Resistance Rds

0.165Ω

Forward Voltage Vf

-1.2V

Maximum Power Dissipation Pd

2.8W

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

7.6nC

Maximum Gate Source Voltage Vgs

8V

Maximum Operating Temperature

+150°C

Standards/Approvals

RoHS

Height

1.1mm

Automotive Standard

No

Vishay SI1427EDH Series MOSFET, 20V Maximum Drain Source Voltage, 2A Maximum Continuous Drain Current - SI1427EDH-T1-GE3


This p-channel MOSFET is a surface-mount semiconductor intended for switching and power-management roles in compact electronic assemblies. It operates across a wide temperature span suitable for demanding conditions and is provided in a low-profile package for space-constrained board designs.

Features and Benefits:


• Low Rds(on) 0.165Ω for reduced conduction losses
• Continuous drain current rating of 2A for medium-power switching
• Drain-source voltage rating of 20V enables low-voltage systems
• Typical gate charge 7.6 nC for predictable switching performance
• Forward voltage of -1.2V minimises voltage drop during conduction
• RoHS compliant for use in regulated manufacturing environments

Applications


• Suitable for battery-protection and load-switch circuits
• Ideal for handheld and portable device power paths
• Used with DC-DC converters in compact assemblies
• Can be used for reverse-current blocking in power rails
• Suitable for low-voltage motor-control gate arrangements

What package considerations affect board layout?


It is supplied in an SC-70 package with six pins, permitting tight pad arrangements and straightforward reflow soldering for dense surface-mount designs.

How does thermal performance influence cooling requirements?


Maximum power dissipation is 2.8 W, so PCB copper area and thermal vias should be sized to remove heat when operating near that dissipation level.

What gate limitations must designers observe?


The gate must not exceed 8V relative to the source to avoid damaging the device, and the typical gate charge of 7.6 nC guides driver selection.

How does the device cope with extreme ambient conditions?


It is rated to function from -55 °C up to +150 °C, permitting use where wide thermal endurance is required.

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