Vishay IRFR9010 Type P-Channel Power MOSFET, -5.3 A, -50 V, 3-Pin TO-252 IRFR9010TRPBF

Sous-total (1 paquet de 10 unités)*

6,40 €

(TVA exclue)

7,70 €

(TVA incluse)

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10 +0,64 €6,40 €

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N° de stock RS:
256-7311
Référence fabricant:
IRFR9010TRPBF
Fabricant:
Vishay
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Marque

Vishay

Product Type

Power MOSFET

Channel Type

Type P

Maximum Continuous Drain Current Id

-5.3A

Maximum Drain Source Voltage Vds

-50V

Series

IRFR9010

Package Type

TO-252

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

0.5Ω

Typical Gate Charge Qg @ Vgs

9.1nC

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

25W

Forward Voltage Vf

-5.5V

Maximum Gate Source Voltage Vgs

20V

Maximum Operating Temperature

150°C

Standards/Approvals

RoHS

Height

2.39mm

Automotive Standard

No

Vishay IRFR9010 Series Power MOSFET, 50V Maximum Drain Source Voltage, 5.3A Maximum Continuous Drain Current - IRFR9010TRPBF


This power MOSFET is a P‑channel semiconductor device designed for switching and power-management roles in surface-mount assemblies. It operates across a wide thermal range and is suited to circuits requiring controlled high-current switching and moderate voltage handling in compact TO‑252 packaging.

Features and Benefits:


• 50V drain-to-source rating enables moderate-voltage switching
• 0.5Ω Rds(on) reduces conduction losses in load paths
• 5.3A continuous drain current supports sustained current delivery
• 9.1nC typical gate charge allows faster gate-drive response
• 25W maximum power dissipation permits higher thermal loading
• -55°C to +150°C operating range supports harsh environments

Applications


• Suitable for high-side switching in power rails
• Ideal for battery management and load disconnects
• Used with compact converters requiring surface mount
• Can be used for reverse-polarity protection circuits
• Suitable for thermal-stress testing in electronics validation

What package type does it use and how does that affect mounting?


It comes in a TO‑252 package designed for surface mounting, providing a low-profile option compatible with reflow processes and enabling thermal coupling to PCB copper for heat dissipation.

What gate-drive limitations should be considered during design?


The device tolerates up to 20V between gate and source, so gate drivers must remain within that range to avoid damaging the gate oxide.

How should thermal management be approached on a PCB?


Given a 25W maximum dissipation, designers should allocate adequate copper area or thermal vias beneath the package to spread heat and maintain junction temperature within safe limits.

Are there special considerations for switching performance?


The typical gate charge of 9.1nC implies moderate gate-drive energy

driver selection should balance switching speed against EMI and drive power.

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