Infineon OptiMOS P Type P-Channel MOSFET, 40 A, 30 V Enhancement, 8-Pin TSDSON

Sous-total (1 bobine de 5000 unités)*

1 380,00 €

(TVA exclue)

1 670,00 €

(TVA incluse)

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  • Expédition à partir du 04 janvier 2027
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Unité
Prix par unité
la bobine*
5000 +0,276 €1 380,00 €

*Prix donné à titre indicatif

N° de stock RS:
165-6878
Référence fabricant:
BSZ086P03NS3GATMA1
Fabricant:
Infineon
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Marque

Infineon

Product Type

MOSFET

Channel Type

Type P

Maximum Continuous Drain Current Id

40A

Maximum Drain Source Voltage Vds

30V

Series

OptiMOS P

Package Type

TSDSON

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

13.4mΩ

Channel Mode

Enhancement

Forward Voltage Vf

-1.1V

Maximum Power Dissipation Pd

69W

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

43.2nC

Maximum Operating Temperature

150°C

Length

3.4mm

Standards/Approvals

No

Height

1.1mm

Automotive Standard

No

Statut RoHS non applicable

Pays d'origine :
CN

Infineon OptiMOS P Series MOSFET, 30V Drain Source Voltage, 40A Continuous Drain Current - BSZ086P03NS3GATMA1


This MOSFET is a P‑channel enhancement device designed for surface‑mount power switching in industrial temperature environments. It operates across an extended ambient range and is intended for high‑current switching roles where compact, low‑profile packaging is required.

Features and Benefits:


• 30V drain-source rating supports low‑voltage power rails
• 40A continuous drain current enables high‑current switching
• 13.4 mΩ low Rds(on) reduces conduction losses
• 69W maximum power dissipation manages thermal load
• 43.2 nC typical gate charge balances switching speed and drive demand
• 25V maximum gate-source voltage permits robust gate‑drive margins

Applications


• Suitable for synchronous buck converters in power supplies
• Ideal for DC motor control and drive stages
• Used for load switching in telecoms and server power systems
• Can be used for battery management and distribution circuits
• Suitable for compact power modules requiring low‑profile components

What package type should I expect for PCB assembly?


It is supplied in an 8‑pin TSDSON surface‑mount package suitable for automated pick‑and‑place and reflow soldering processes.

How does the device handle wide temperature ranges during operation?


The component is specified to operate from -55°C up to 150°C, allowing use in harsh industrial temperature conditions with appropriate thermal management.

What channel conduction polarity must the gate driver accommodate?


The device is P‑channel, so gate‑drive logic must be arranged for P‑type enhancement operation and appropriate pull‑up/pull‑down signalling.

Are there mounting or profile advantages to consider?


The low‑profile 1.1mm package height supports space‑constrained layouts and enables dense assembly in compact power designs.

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