Infineon Isolated HEXFET 2 Type P, Type N-Channel MOSFET, 3.5 A, 30 V Enhancement, 8-Pin SOIC
- N° de stock RS:
- 145-9491
- Référence fabricant:
- IRF9952TRPBF
- Fabricant:
- Infineon
Sous-total (1 bobine de 4000 unités)*
1 176,00 €
(TVA exclue)
1 424,00 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 05 mai 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité | Prix par unité | la bobine* |
|---|---|---|
| 4000 + | 0,294 € | 1 176,00 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 145-9491
- Référence fabricant:
- IRF9952TRPBF
- Fabricant:
- Infineon
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Infineon | |
| Product Type | MOSFET | |
| Channel Type | Type P, Type N | |
| Maximum Continuous Drain Current Id | 3.5A | |
| Maximum Drain Source Voltage Vds | 30V | |
| Series | HEXFET | |
| Package Type | SOIC | |
| Mount Type | Surface | |
| Pin Count | 8 | |
| Maximum Drain Source Resistance Rds | 400mΩ | |
| Channel Mode | Enhancement | |
| Maximum Power Dissipation Pd | 2W | |
| Typical Gate Charge Qg @ Vgs | 6.1nC | |
| Maximum Gate Source Voltage Vgs | 20 V | |
| Minimum Operating Temperature | -55°C | |
| Forward Voltage Vf | 0.82V | |
| Transistor Configuration | Isolated | |
| Maximum Operating Temperature | 150°C | |
| Length | 5mm | |
| Height | 1.5mm | |
| Width | 4 mm | |
| Standards/Approvals | No | |
| Number of Elements per Chip | 2 | |
| Automotive Standard | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Infineon | ||
Product Type MOSFET | ||
Channel Type Type P, Type N | ||
Maximum Continuous Drain Current Id 3.5A | ||
Maximum Drain Source Voltage Vds 30V | ||
Series HEXFET | ||
Package Type SOIC | ||
Mount Type Surface | ||
Pin Count 8 | ||
Maximum Drain Source Resistance Rds 400mΩ | ||
Channel Mode Enhancement | ||
Maximum Power Dissipation Pd 2W | ||
Typical Gate Charge Qg @ Vgs 6.1nC | ||
Maximum Gate Source Voltage Vgs 20 V | ||
Minimum Operating Temperature -55°C | ||
Forward Voltage Vf 0.82V | ||
Transistor Configuration Isolated | ||
Maximum Operating Temperature 150°C | ||
Length 5mm | ||
Height 1.5mm | ||
Width 4 mm | ||
Standards/Approvals No | ||
Number of Elements per Chip 2 | ||
Automotive Standard No | ||
Infineon HEXFET Series MOSFET, 2.3A/3.5A Maximum Continuous Drain Current, 2W Maximum Power Dissipation - IRF9952TRPBF
This versatile MOSFET delivers high performance in a Compact package, integrating both N-channel and P-channel configurations. It is designed for effective operation in various electronic applications, ensuring efficiency and dependability. With a maximum drain current of 3.5A and a maximum drain-source voltage of 30V, it is suitable for applications that require robust switching capabilities.
Features & Benefits
• Dual-channel configuration enhances design flexibility
• Surface mount design simplifies PCB assembly
• Low resistance (150mΩ and 400mΩ) reduces power loss
• High temperature operation (+150°C) ensures reliability in extreme conditions
• Improved gate charge characteristics enhance switching efficiency
• Isolated transistor configuration minimises cross-talk for cleaner signals
Applications
• Power management solutions
• Electric vehicle systems for improved efficiency
• Industrial automation and control
• Renewable energy systems for optimal performance
• Consumer electronics for enhanced device performance
How does the isolation of this device benefit my application?
The isolated configuration minimises interference among circuits, ensuring clean signals and preventing unwanted interactions between components.
What temperature range can this device handle during operation?
It can operate within a temperature range of -55°C to +150°C, making it suitable for extreme conditions.
Can I use this product in my surface mount PCB design?
Yes, its surface mount design allows for easy integration into PCB layouts, optimising space and enhancing thermal performance.
What factors should I consider when using this for switching applications?
Ensure the maximum gate-source voltage of ±20V is not exceeded and verify that the gate charge aligns with your switching frequency for optimal performance.
How do the specifications affect my power efficiency?
With low on-resistance and high continuous drain current, this MOSFET contributes to minimal power loss, enhancing overall energy efficiency in your circuit designs.
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