STMicroelectronics 4 MOSFET Modules, 58 A, 650 V, 30-Pin ACEPACK 2 A2F20M65W3-FC
- N° de stock RS:
- 331-763
- Référence fabricant:
- A2F20M65W3-FC
- Fabricant:
- STMicroelectronics
Visuel non contractuel
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
- N° de stock RS:
- 331-763
- Référence fabricant:
- A2F20M65W3-FC
- Fabricant:
- STMicroelectronics
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | STMicroelectronics | |
| Product Type | MOSFET Modules | |
| Maximum Continuous Drain Current Id | 58A | |
| Maximum Drain Source Voltage Vds | 650V | |
| Package Type | ACEPACK 2 | |
| Mount Type | Screw | |
| Pin Count | 30 | |
| Number of Elements per Chip | 4 | |
| Sélectionner tout | ||
|---|---|---|
Marque STMicroelectronics | ||
Product Type MOSFET Modules | ||
Maximum Continuous Drain Current Id 58A | ||
Maximum Drain Source Voltage Vds 650V | ||
Package Type ACEPACK 2 | ||
Mount Type Screw | ||
Pin Count 30 | ||
Number of Elements per Chip 4 | ||
- Pays d'origine :
- CN
The STMicroelectronics power module realizes a four pack topology in an ACEPACK 2 module with NTC and capacitance, integrating the latest advances in silicon carbide MOSFETs from STMicroelectronics, represented by third generation technology. This modular solution is used to realize complex topologies with very high power density and efficiency requirements.
Four pack topology
23 mΩ of typical RDS(on) each switch
Insulation voltage 2.5 kVrms
Integrated NTC temperature sensor
Integrated DC link capacitor
DBC Cu-Al2O3-Cu based
Press-fit contact pins
Liens connexes
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