STMicroelectronics A2TBH45M65W3-FC 5 MOSFET Module, 28 A, 650 V, 30-Pin ACEPACK 2 A2TBH45M65W3-FC
- N° de stock RS:
- 331-765
- Référence fabricant:
- A2TBH45M65W3-FC
- Fabricant:
- STMicroelectronics
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Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
- N° de stock RS:
- 331-765
- Référence fabricant:
- A2TBH45M65W3-FC
- Fabricant:
- STMicroelectronics
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | STMicroelectronics | |
| Maximum Continuous Drain Current | 28 A | |
| Maximum Drain Source Voltage | 650 V | |
| Series | A2TBH45M65W3-FC | |
| Package Type | ACEPACK 2 | |
| Mounting Type | Screw Mount | |
| Pin Count | 30 | |
| Number of Elements per Chip | 5 | |
| Sélectionner tout | ||
|---|---|---|
Marque STMicroelectronics | ||
Maximum Continuous Drain Current 28 A | ||
Maximum Drain Source Voltage 650 V | ||
Series A2TBH45M65W3-FC | ||
Package Type ACEPACK 2 | ||
Mounting Type Screw Mount | ||
Pin Count 30 | ||
Number of Elements per Chip 5 | ||
- Pays d'origine :
- CN
The STMicroelectronics power module realizes a triple boost plus half-bridge topology in an ACEPACK 2 module with NTC and capacitance, integrating the latest advances in silicon carbide MOSFETs from STMicroelectronics, represented by third generation technology. This modular solution is used to realize complex topologies with very high power density and efficiency requirements.
Triple boost switch 49 mΩ of typical RDS(on)
Half bridge switch 23.5 mΩ of typical RDS(on)
Insulation voltage 2.5 kVrms
Integrated NTC temperature sensor
Integrated DC link capacitor
DBC Cu-Al2O3-Cu based
Press-fit contact pins
Half bridge switch 23.5 mΩ of typical RDS(on)
Insulation voltage 2.5 kVrms
Integrated NTC temperature sensor
Integrated DC link capacitor
DBC Cu-Al2O3-Cu based
Press-fit contact pins
Liens connexes
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