Infineon XHP Dual SiC Dual N-Channel MOSFET, 1.2 kA, 1700 V Depletion Tray FF1200XTR17T2P5BPSA1
- N° de stock RS:
- 277-191
- Référence fabricant:
- FF1200XTR17T2P5BPSA1
- Fabricant:
- Infineon
Indisponible
RS n'aura plus ce produit en stock.
- N° de stock RS:
- 277-191
- Référence fabricant:
- FF1200XTR17T2P5BPSA1
- Fabricant:
- Infineon
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Infineon | |
| Channel Type | Dual N | |
| Maximum Continuous Drain Current | 1.2 kA | |
| Maximum Drain Source Voltage | 1700 V | |
| Series | XHP | |
| Package Type | Tray | |
| Mounting Type | Screw Mount | |
| Channel Mode | Depletion | |
| Number of Elements per Chip | 2 | |
| Transistor Material | SiC | |
| Sélectionner tout | ||
|---|---|---|
Marque Infineon | ||
Channel Type Dual N | ||
Maximum Continuous Drain Current 1.2 kA | ||
Maximum Drain Source Voltage 1700 V | ||
Series XHP | ||
Package Type Tray | ||
Mounting Type Screw Mount | ||
Channel Mode Depletion | ||
Number of Elements per Chip 2 | ||
Transistor Material SiC | ||
- Pays d'origine :
- DE
The Infineon IGBT module is a XHP 2 1700 V, 1200 A dual IGBT module with .XT interconnection technology and TRENCHSTOP IGBT5 for high reliability and robustness, combined with system availability and long lifetime for high power traction and wind applications.
Copper bonds for high current carrying capabilities
Sintering of chips for highest power cycling capabilities
Less cooling effort for same output power
Enables higher system overload conditions
Sintering of chips for highest power cycling capabilities
Less cooling effort for same output power
Enables higher system overload conditions
Liens connexes
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