TE Connectivity 0.5mm Pitch 260 Way, Right Angle Board Mount Mount Small Outline DIMM Socket ,1.2 V ,500mA
- N° de stock RS:
- 470-731
- Référence fabricant:
- 2309413-3
- Fabricant:
- TE Connectivity
Sous-total (1 bobine de 250 unités)*
607,04 €
(TVA exclue)
734,52 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 19 janvier 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s) | la bobine | Prix par unité* |
|---|---|---|
| 1 + | 607,04 € | 2,428 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 470-731
- Référence fabricant:
- 2309413-3
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Memory Socket Type | DIMM Socket | |
| Gender | Female | |
| Body Orientation | Right Angle | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Number of Contacts | 260 | |
| Pitch | 0.5mm | |
| Mounting Type | Board Mount | |
| SDRAM Type | Small Outline | |
| Current Rating | 500mA | |
| Voltage Rating | 1.2 V | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Memory Socket Type DIMM Socket | ||
Gender Female | ||
Body Orientation Right Angle | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Number of Contacts 260 | ||
Pitch 0.5mm | ||
Mounting Type Board Mount | ||
SDRAM Type Small Outline | ||
Current Rating 500mA | ||
Voltage Rating 1.2 V | ||
- Pays d'origine :
- CN
The TE Connectivity DDR4 SO DIMM Socket is an innovative solution designed for high-performance memory applications. With a compact stack height of 9.2 mm and a right-angle module orientation, this socket facilitates seamless integration into various printed circuit board layouts. Engineered to accommodate 260 positions, it boasts a centerline of 0.5 mm, making it an ideal choice for modern computing systems. This product combines advanced materials with a robust design to ensure durability and reliability in demanding environments, while also being compliant with significant industry standards. The retention features provide extra security, guaranteeing that the memory module remains firmly in place during operation. With its ability to withstand operating temperatures ranging from -55 to 85 °C, this socket is well-equipped to meet the rigorous requirements of today's technological landscape.
Designed for effortless installation and reliable performance
Utilizes high-temperature thermoplastic materials for enhanced durability
Incorporates stainless steel retention posts for added module security
Supports reflow solder processes for efficient assembly
Configured with standard keying for easy mating alignment
Low halogen content contributes to environmental compliance
Utilizes high-temperature thermoplastic materials for enhanced durability
Incorporates stainless steel retention posts for added module security
Supports reflow solder processes for efficient assembly
Configured with standard keying for easy mating alignment
Low halogen content contributes to environmental compliance
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