TE Connectivity 0.5 mm Pitch 260 Way, Right Angle Board Mount DIMM Socket ,1.2 V, 500mA

Sous-total (1 bobine de 250 unités)*

607,04 €

(TVA exclue)

734,52 €

(TVA incluse)

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  • Expédition à partir du 23 mars 2026
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Bobine(s)
la bobine
Prix par unité*
1 +607,04 €2,428 €

*Prix donné à titre indicatif

N° de stock RS:
470-731
Numéro d'article Distrelec:
304-59-556
Référence fabricant:
2309413-3
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

DIMM Socket

Memory Socket Type

DIMM

Insertion/Removal Method

Cam-In

Orientation

Right Angle

Current

500mA

Contact Material

Copper Alloy

Contact Plating

Gold

Number of Contacts

260

Pitch

0.5mm

Mount Type

Board

Housing Material

High Temperature Thermoplastic

Termination Type

Surface Mount

Latching

Yes

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

85°C

Row Spacing

8.2mm

Standards/Approvals

EU REACH Regulation (EC) No. 1907/2006, 2016, UL 94V-0, EU RoHS Directive 2011/65/EU, EU ELV Directive 2000/53/EC, China RoHS 2 Directive MIIT Order No 32

Series

DDR4 DIMM

Voltage

1.2 V

Pays d'origine :
CN
The TE Connectivity DDR4 SO DIMM Socket is an innovative solution designed for high-performance memory applications. With a compact stack height of 9.2 mm and a right-angle module orientation, this socket facilitates seamless integration into various printed circuit board layouts. Engineered to accommodate 260 positions, it boasts a centerline of 0.5 mm, making it an ideal choice for modern computing systems. This product combines advanced materials with a robust design to ensure durability and reliability in demanding environments, while also being compliant with significant industry standards. The retention features provide extra security, guaranteeing that the memory module remains firmly in place during operation. With its ability to withstand operating temperatures ranging from -55 to 85 °C, this socket is well-equipped to meet the rigorous requirements of today's technological landscape.

Designed for effortless installation and reliable performance

Utilizes high-temperature thermoplastic materials for enhanced durability

Incorporates stainless steel retention posts for added module security

Supports reflow solder processes for efficient assembly

Configured with standard keying for easy mating alignment

Low halogen content contributes to environmental compliance

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