TE Connectivity 0.5mm Pitch 260 Way, Right Angle Board Mount Mount Small Outline DIMM Socket ,1.2 V ,500mA
- N° de stock RS:
- 481-905
- Référence fabricant:
- 2309414-3
- Fabricant:
- TE Connectivity
Sous-total (1 bobine de 250 unités)*
454,25 €
(TVA exclue)
549,64 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 19 janvier 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s) | la bobine | Prix par unité* |
|---|---|---|
| 1 + | 454,25 € | 1,817 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 481-905
- Référence fabricant:
- 2309414-3
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Memory Socket Type | DIMM Socket | |
| Gender | Female | |
| Body Orientation | Right Angle | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Number of Contacts | 260 | |
| Pitch | 0.5mm | |
| Mounting Type | Board Mount | |
| SDRAM Type | Small Outline | |
| Current Rating | 500mA | |
| Voltage Rating | 1.2 V | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Memory Socket Type DIMM Socket | ||
Gender Female | ||
Body Orientation Right Angle | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Number of Contacts 260 | ||
Pitch 0.5mm | ||
Mounting Type Board Mount | ||
SDRAM Type Small Outline | ||
Current Rating 500mA | ||
Voltage Rating 1.2 V | ||
- Pays d'origine :
- CN
The TE Connectivity Small outline DDR4 SO DIMM socket is engineered for superior performance and reliability in compact electronic applications. With a stack height of just 9.2 mm and a right angle module orientation, it facilitates efficient space utilisation while ensuring robust connections. This socket accommodates up to 260 positions and features a .5 mm centreline pitch, designed specifically for high-speed memory applications. Its high-temperature thermoplastic housing guarantees durability, while innovative design elements, such as reverse keying and locking ejectors, enhance user experience during installation and maintenance. The product complies with stringent industry standards and regulations, making it an ideal choice for modern computing environments.
Designed for seamless integration into high speed memory solutions
Constructed from materials that ensure longevity and reliable performance
Includes advanced mounting features for secure PCB attachment
Optimised for a wide operating temperature range for versatile applications
Features low halogen materials promoting environmentally friendly use
Facilitates straightforward installation with intuitive alignment mechanisms
Accommodates a variety of memory configurations to meet diverse needs
Backed by comprehensive compliance documentation to support regulatory requirements
Constructed from materials that ensure longevity and reliable performance
Includes advanced mounting features for secure PCB attachment
Optimised for a wide operating temperature range for versatile applications
Features low halogen materials promoting environmentally friendly use
Facilitates straightforward installation with intuitive alignment mechanisms
Accommodates a variety of memory configurations to meet diverse needs
Backed by comprehensive compliance documentation to support regulatory requirements
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