TE Connectivity 0.6 mm Pitch 200 Way, Right Angle Board Mount DDR3 DIMM Socket ,1.8 V, 500mA
- N° de stock RS:
- 504-768
- Numéro d'article Distrelec:
- 304-63-239
- Référence fabricant:
- 1981287-4
- Fabricant:
- TE Connectivity
Sous-total (1 plateau de 12 unités)*
192,08 €
(TVA exclue)
232,42 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 13 mars 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Plateau(x) | le plateau | Prix par unité* |
|---|---|---|
| 1 + | 192,08 € | 16,007 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 504-768
- Numéro d'article Distrelec:
- 304-63-239
- Référence fabricant:
- 1981287-4
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Memory Socket Type | DIMM | |
| Product Type | DIMM Socket | |
| Orientation | Right Angle | |
| Insertion/Removal Method | Cam-In | |
| Contact Material | Copper Alloy | |
| Current | 500mA | |
| Contact Plating | Gold | |
| Number of Contacts | 200 | |
| Pitch | 0.6mm | |
| Mount Type | Board | |
| Housing Material | High Temperature Thermoplastic | |
| SDRAM Type | DDR3 | |
| Latching | Yes | |
| Termination Type | Surface Mount | |
| Maximum Operating Temperature | 260°C | |
| Row Spacing | 6.2mm | |
| Standards/Approvals | UL 94V-0, EU RoHS Directive 2011/65/EU Compliant, 2016, EU ELV Directive 2000/53/EC Compliant, China RoHS 2 Directive MIIT Order No 32 | |
| Series | DDR2 SO DIMM | |
| Voltage | 1.8 V | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Memory Socket Type DIMM | ||
Product Type DIMM Socket | ||
Orientation Right Angle | ||
Insertion/Removal Method Cam-In | ||
Contact Material Copper Alloy | ||
Current 500mA | ||
Contact Plating Gold | ||
Number of Contacts 200 | ||
Pitch 0.6mm | ||
Mount Type Board | ||
Housing Material High Temperature Thermoplastic | ||
SDRAM Type DDR3 | ||
Latching Yes | ||
Termination Type Surface Mount | ||
Maximum Operating Temperature 260°C | ||
Row Spacing 6.2mm | ||
Standards/Approvals UL 94V-0, EU RoHS Directive 2011/65/EU Compliant, 2016, EU ELV Directive 2000/53/EC Compliant, China RoHS 2 Directive MIIT Order No 32 | ||
Series DDR2 SO DIMM | ||
Voltage 1.8 V | ||
- Pays d'origine :
- CN
The TE Connectivity Semi-hard tray is designed for high-performance applications, providing reliable memory socket connections. Constructed to meet the demands of modern computing environments, this product supports DDR memory with a robust structure that ensures durability and longevity. Its carefully engineered specifications offer an ideal solution for various configurations, making it an essential component for both industrial and consumer electronic devices. With advanced features that enhance both performance and compatibility, it streamlines integration into any existing setup.
Offers a double data rate for improved data throughput
Constructed with high-temperature thermoplastic for enhanced durability
Features reverse keying for simple and secure connections
Includes locking ejectors at both ends for added security during operation
Designed for surface mount termination, ensuring a reliable fit
Contains gold flash plating in the contact area for superior conductivity
Provides low halogen content for reduced environmental impact
Compliance with EU RoHS and REACH directives for eco-friendly use
Liens connexes
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