TE Connectivity 0.6 mm Pitch 200 Way, Right Angle Board Mount DDR2 DIMM Socket ,1.8 V, 500mA

Sous-total (1 plateau de 25 unités)*

167,27 €

(TVA exclue)

202,40 €

(TVA incluse)

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  • Expédition à partir du 13 mars 2026
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Prix par unité*
1 +167,27 €6,691 €

*Prix donné à titre indicatif

N° de stock RS:
474-957
Numéro d'article Distrelec:
304-63-064
Référence fabricant:
1612773-4
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Memory Socket Type

DIMM

Product Type

DIMM Socket

Orientation

Right Angle

Insertion/Removal Method

Cam-In

Contact Material

Copper Alloy

Current

500mA

Contact Plating

Gold Flash

Number of Contacts

200

Pitch

0.6mm

Mount Type

Board

Housing Material

High Temperature Thermoplastic

SDRAM Type

DDR2

Termination Type

Surface Mount

Minimum Operating Temperature

-55°C

Latching

Yes

Maximum Operating Temperature

85°C

Row Spacing

6.2mm

Standards/Approvals

China RoHS 2 Directive MIIT Order No 32, 2016, EU RoHS Directive 2011/65/EU Compliant, EU ELV Directive 2000/53/EC Compliant, UL 94V-0

Series

DDR2 SO DIMM

Voltage

1.8 V

Pays d'origine :
CN
The TE Connectivity Socket is engineered to provide dependable connectivity in dynamic computing environments. With a right-angle module orientation and a stack height of 6.5 mm, it delivers optimal space efficiency, making it ideal for compact designs. This versatile socket is designed for high-performance memory applications, supporting double data rate technology to facilitate rapid data transfer. Its robust construction ensures longevity and reliability, while the advanced termination method simplifies integration onto PCB surfaces. Perfect for varied memory applications, it represents a blend of innovation and functionality, ensuring seamless operation in your devices.

Designed for high-performance memory solutions

Offering efficient space utilisation for compact applications

Robust design ensures long-lasting performance and reliability

Facilitates rapid data transfer with double data rate technology

Innovative termination method enhances integration ease

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