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Sélectionner tout	Attribut	Valeur
	Marque	Amphenol Communications Solutions
	Product Type	IC Socket
	IC Socket Type	Prototyping Socket
	Package Type	Surface Mount
	Number of Contacts	400
	Current	450mA
	Number of Rows	8
	Pitch	1.27mm
	Voltage	200 V
	Orientation	Straight
	Contact Material	Copper Alloy
	Contact Plating	Gold
	Socket Mount Type	Surface
	Minimum Operating Temperature	-55°C
	Row Pitch	1.27mm
	Termination Type	Solder
	Device Mount Type	Surface
	Maximum Operating Temperature	85°C
	Series	Meg-Array
	Standards/Approvals	No
	Housing Material	Liquid Crystal Polymer

	Sélectionner tout
	Marque Amphenol Communications Solutions
	Product Type IC Socket
	IC Socket Type Prototyping Socket
	Package Type Surface Mount
	Number of Contacts 400
	Current 450mA
	Number of Rows 8
	Pitch 1.27mm
	Voltage 200 V
	Orientation Straight
	Contact Material Copper Alloy
	Contact Plating Gold
	Socket Mount Type Surface
	Minimum Operating Temperature -55°C
	Row Pitch 1.27mm
	Termination Type Solder
	Device Mount Type Surface
	Maximum Operating Temperature 85°C
	Series Meg-Array
	Standards/Approvals No
	Housing Material Liquid Crystal Polymer

High density, high speed, discrete contact, array connector

Flexible ground distribution optimizes high speed signal integrity

10Gb/s differential pair performance with under 1% cross-talk

28Gb/s high speed performance documented for 4 mm and 6 mm stack height

Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market

1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space

Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility

6 PCB Stack heights: 4 mm to 14mm

8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform

High density standard BGA attachment lower assembly costs by using standard SMT processes

BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage

Patented BGA contact attachment preserves solder ball positioning

Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability

Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options

400 Position BGA Receptacle, 4 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free

Amphenol Communications Solutions 1.27 mm Pitch 400 Way Surface Mount Surface Prototyping IC Socket

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