- N° de stock RS:
- 182-2279
- Référence fabricant:
- 74221-101LF
- Fabricant:
- Amphenol Communications Solutions
En cours d'approvisionnement - expédition le 09/10/2024, livraison sous 4 jour(s)
Ajouté
Prix L'unité (sur une bobine de 250)
23,713 €
(TVA exclue)
28,693 €
(TVA incluse)
Unité | Prix par unité | la bobine* |
250 + | 23,713 € | 5 928,25 € |
*prix conseillé |
Produit de remplacement
Ce produit n'est pas disponible actuellement. Voici notre produit de remplacement:
- N° de stock RS:
- 182-2279
- Référence fabricant:
- 74221-101LF
- Fabricant:
- Amphenol Communications Solutions
Documentation technique
Législations et de normes
- Pays d'origine :
- US
Détails du produit
High density, high speed, discrete contact, array connector
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
400 Position BGA Receptacle, 4 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free
Spécifications
Attribut | Valeur |
---|---|
IC Socket Type | Prototyping Socket |
Package Type | BGA |
Gender | Female |
Number of Contacts | 400 |
Contact Material | Copper Alloy |
Contact Plating | Gold |
Current Rating | 450.0mA |
Socket Mounting Type | Surface Mount |
Device Mounting Type | Surface Mount |
Voltage Rating | 200.0 V |
Termination Method | Through Hole |
Housing Material | Liquid Crystal Polymer |
- N° de stock RS:
- 182-2279
- Référence fabricant:
- 74221-101LF
- Fabricant:
- Amphenol Communications Solutions