TE Connectivity 1366 Way LGA Prototyping IC Socket
- N° de stock RS:
- 478-441
- Numéro d'article Distrelec:
- 304-49-467
- Référence fabricant:
- 1981837-2
- Fabricant:
- TE Connectivity
Sous-total (1 plateau de 12 unités)*
261,38 €
(TVA exclue)
316,27 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 16 mars 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Plateau(x) | le plateau | Prix par unité* |
|---|---|---|
| 1 + | 261,38 € | 21,782 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 478-441
- Numéro d'article Distrelec:
- 304-49-467
- Référence fabricant:
- 1981837-2
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Product Type | IC Socket | |
| IC Socket Type | Prototyping Socket | |
| Package Type | LGA | |
| Number of Contacts | 1366 | |
| Contact Plating | Gold | |
| Maximum Operating Temperature | 260°C | |
| Standards/Approvals | EU REACH Regulation (EC) No. 1907/2006, China RoHS 2 Directive MIIT Order No 32, EU RoHS Directive 2011/65/EU Compliant, EU ELV Directive 2000/53/EC Compliant, 2016 No Restricted Materials Above Threshold | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Product Type IC Socket | ||
IC Socket Type Prototyping Socket | ||
Package Type LGA | ||
Number of Contacts 1366 | ||
Contact Plating Gold | ||
Maximum Operating Temperature 260°C | ||
Standards/Approvals EU REACH Regulation (EC) No. 1907/2006, China RoHS 2 Directive MIIT Order No 32, EU RoHS Directive 2011/65/EU Compliant, EU ELV Directive 2000/53/EC Compliant, 2016 No Restricted Materials Above Threshold | ||
- Pays d'origine :
- CN
The TE Connectivity Socket assembly LGA1366, designed specifically for high-performance computing applications, delivers reliable connectivity with an emphasis on durability and efficiency. Constructed to accommodate various operational requirements, this component supports seamless integration in advanced configurations. With a focus on compliance, the design adheres to critical industry standards, making it ideal for use in environments where regulatory adherence is paramount. This product stands out in its ability to maintain efficient thermal management and electrical performance under demanding conditions, catering to the needs of engineers and designers alike. Its low halogen content further enhances its environmental credentials, ensuring it meets modern sustainability expectations.
Designed to support sophisticated LGA1366 processor configurations
Low halogen content ensures compliance with environmental regulations
Built for reliable thermal management during high-stress operations
Facilitates easy integration with existing modular systems
Constructed for enhanced durability, adapting to various industrial applications
Backed by comprehensive compliance documentation for peace of mind
Optimised for reflow solder processes with high-temperature capabilities
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