TE Connectivity 1366 Way LGA Prototyping IC Socket
- N° de stock RS:
- 478-437
- Numéro d'article Distrelec:
- 304-49-466
- Référence fabricant:
- 1981467-1
- Fabricant:
- TE Connectivity
Sous-total (1 paquet de 6 unités)*
254,77 €
(TVA exclue)
308,27 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 13 mars 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Paquet(s) | le paquet | Prix par unité* |
|---|---|---|
| 1 + | 254,77 € | 42,462 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 478-437
- Numéro d'article Distrelec:
- 304-49-466
- Référence fabricant:
- 1981467-1
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Product Type | IC Socket | |
| Package Type | LGA | |
| IC Socket Type | Prototyping Socket | |
| Number of Contacts | 1366 | |
| Standards/Approvals | China RoHS 2 Directive MIIT Order No 32, EU RoHS Directive 2011/65/EU Compliant, EU REACH Regulation (EC) No. 1907/2006, EU ELV Directive 2000/53/EC Compliant, 2016 No Restricted Materials Above Threshold | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Product Type IC Socket | ||
Package Type LGA | ||
IC Socket Type Prototyping Socket | ||
Number of Contacts 1366 | ||
Standards/Approvals China RoHS 2 Directive MIIT Order No 32, EU RoHS Directive 2011/65/EU Compliant, EU REACH Regulation (EC) No. 1907/2006, EU ELV Directive 2000/53/EC Compliant, 2016 No Restricted Materials Above Threshold | ||
- Pays d'origine :
- CN
The TE Connectivity Stiffener plate assembly is meticulously designed to cater to LGA1366 processor requirements, providing robust support and stability. Engineered with precision, the product ensures that critical components remain secure during operation, thereby enhancing performance and reliability. Its construction not only addresses physical integrity but also promotes optimal thermal management. As a reliable solution for demanding applications, this assembly effectively mitigates potential risks associated with component misalignment. The clear documentation further establishes its compliance with stringent industry standards, ensuring peace of mind for users. Elevate your system's capabilities with a well-conceived accessory that seamlessly integrates into existing setups, ultimately extending the lifecycle of your hardware.
Constructed to enhance stability for LGA1366 processors
Facilitates optimal thermal management during operation
Supports secure component alignment to mitigate risks
Complies with EU RoHS and ELV directives for safety
Backed by comprehensive technical documentation
Offers an excellent solution for longevity in demanding applications
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