TE Connectivity 1366 Way SMT LGA Prototyping IC Socket
- N° de stock RS:
- 478-437
- Référence fabricant:
- 1981467-1
- Fabricant:
- TE Connectivity
Sous-total (1 paquet de 6 unités)*
254,77 €
(TVA exclue)
308,27 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 03 février 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Paquet(s) | le paquet | Prix par unité* |
|---|---|---|
| 1 + | 254,77 € | 42,462 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 478-437
- Référence fabricant:
- 1981467-1
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| IC Socket Type | Prototyping Socket | |
| Package Type | LGA | |
| Number of Contacts | 1366 | |
| Socket Mounting Type | Surface Mount | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
IC Socket Type Prototyping Socket | ||
Package Type LGA | ||
Number of Contacts 1366 | ||
Socket Mounting Type Surface Mount | ||
- Pays d'origine :
- CN
The TE Connectivity Stiffener plate assembly is meticulously designed to cater to LGA1366 processor requirements, providing robust support and stability. Engineered with precision, the product ensures that critical components remain secure during operation, thereby enhancing performance and reliability. Its construction not only addresses physical integrity but also promotes optimal thermal management. As a reliable solution for demanding applications, this assembly effectively mitigates potential risks associated with component misalignment. The clear documentation further establishes its compliance with stringent industry standards, ensuring peace of mind for users. Elevate your system's capabilities with a well-conceived accessory that seamlessly integrates into existing setups, ultimately extending the lifecycle of your hardware.
Constructed to enhance stability for LGA1366 processors
Facilitates optimal thermal management during operation
Supports secure component alignment to mitigate risks
Complies with EU RoHS and ELV directives for safety
Backed by comprehensive technical documentation
Offers an excellent solution for longevity in demanding applications
Facilitates optimal thermal management during operation
Supports secure component alignment to mitigate risks
Complies with EU RoHS and ELV directives for safety
Backed by comprehensive technical documentation
Offers an excellent solution for longevity in demanding applications
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