TE Connectivity 2.54 mm Pitch 8 Way DIP IC Socket

Sous-total (1 tube de 150 unités)*

227,95 €

(TVA exclue)

275,82 €

(TVA incluse)

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  • Expédition à partir du 16 mars 2026
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Tube(s)
le tube
Prix par unité*
1 +227,95 €1,52 €

*Prix donné à titre indicatif

N° de stock RS:
475-406
Numéro d'article Distrelec:
304-63-056
Référence fabricant:
1571586-2
Fabricant:
TE Connectivity
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Marque

TE Connectivity

IC Socket Type

DIP

Product Type

IC Socket

Current

3A

Number of Contacts

8

Number of Rows

2

Pitch

2.54mm

Orientation

Vertical

Contact Material

Beryllium Copper Alloy

Contact Plating

Tin Plated

Termination Type

Solder

Device Mount Type

Board

Row Pitch

2.54mm

Maximum Operating Temperature

265°C

Standards/Approvals

UL 94 V-0

Housing Material

Thermoplastic Polyester

Pays d'origine :
CH
The TE Connectivity DIP socket connector is engineered to meet the demanding needs of modern electronic applications. Designed with versatility in mind, this product allows for efficient integration into printed circuit boards while ensuring reliable electrical performance. Its solid contact fabrication and dependable mechanical attachment methods make it the ideal choice for both prototyping and production settings. This connector features a standard profile that accommodates various configurations while providing an excellent mating experience, ensuring minimal contact resistance. The robust construction, combined with high insulation resistance, guarantees long-term durability and performance under a range of operating conditions.

Meets the rigorous standards of UL Flammability Rating UL 94V-0

Offers a vertical PCB mount orientation for optimal space utilisation

Utilises a four-fingered mating contact type for superior connectivity

Incorporates a polarisation feature for easy and accurate alignment during installation

Composed of thermoplastic polyester housing for enhanced resilience

Facilitates efficient soldering processes with through-hole termination

Provides a compact design with a low profile height for space-constrained applications

Compatible with wave soldering processes, allowing for mass production efficiency

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