Samtec CLP Series Horizontal Surface PCB Socket, 60-Contact, 2 Row, 1.27 mm Pitch Solder
- N° de stock RS:
- 227-1079
- Référence fabricant:
- CLP-130-02-L-D-P-TR
- Fabricant:
- Samtec
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
- N° de stock RS:
- 227-1079
- Référence fabricant:
- CLP-130-02-L-D-P-TR
- Fabricant:
- Samtec
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Number of Contacts | 60 | |
| Product Type | PCB Socket | |
| Number of Rows | 2 | |
| Sub Type | Dual Wipe Socket | |
| Pitch | 1.27mm | |
| Current | 3.4A | |
| Termination Type | Solder | |
| Housing Material | Liquid Crystal Polymer | |
| Mount Type | Surface | |
| Orientation | Horizontal | |
| Connector System | Board-to-Board | |
| Voltage | 395V | |
| Series | CLP | |
| Row Pitch | 1.27mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Plating | Gold | |
| Contact Material | Phosphor Bronze | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Number of Contacts 60 | ||
Product Type PCB Socket | ||
Number of Rows 2 | ||
Sub Type Dual Wipe Socket | ||
Pitch 1.27mm | ||
Current 3.4A | ||
Termination Type Solder | ||
Housing Material Liquid Crystal Polymer | ||
Mount Type Surface | ||
Orientation Horizontal | ||
Connector System Board-to-Board | ||
Voltage 395V | ||
Series CLP | ||
Row Pitch 1.27mm | ||
Minimum Operating Temperature -55°C | ||
Contact Plating Gold | ||
Contact Material Phosphor Bronze | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals No | ||
The Samtec CLP series 1.27mm low profile dual wipe socket has 30 positions and surface mount lead style. It has 0.000254mm light selective gold in contact area and matte tin on tail.
Dual row
Pick & place pad
Alignment Pin
Tape and reel packaging
Liens connexes
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