Samtec CLP Series Horizontal Surface PCB Socket, 60-Contact, 2 Row, 1.27 mm Pitch Solder
- N° de stock RS:
- 227-1079
- Référence fabricant:
- CLP-130-02-L-D-P-TR
- Fabricant:
- Samtec
Sous-total (1 bobine de 1475 unités)*
8 942,925 €
(TVA exclue)
10 820,60 €
(TVA incluse)
Informations sur le stock actuellement non accessibles - Veuillez vérifier plus tard
Unité | Prix par unité | la bobine* |
|---|---|---|
| 1475 + | 6,063 € | 8 942,93 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 227-1079
- Référence fabricant:
- CLP-130-02-L-D-P-TR
- Fabricant:
- Samtec
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Number of Contacts | 60 | |
| Product Type | PCB Socket | |
| Sub Type | Dual Wipe Socket | |
| Number of Rows | 2 | |
| Current | 3.4A | |
| Pitch | 1.27mm | |
| Termination Type | Solder | |
| Housing Material | Liquid Crystal Polymer | |
| Mount Type | Surface | |
| Orientation | Horizontal | |
| Connector System | Board-to-Board | |
| Voltage | 395 V | |
| Series | CLP | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 1.27mm | |
| Contact Plating | Gold | |
| Contact Material | Phosphor Bronze | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Number of Contacts 60 | ||
Product Type PCB Socket | ||
Sub Type Dual Wipe Socket | ||
Number of Rows 2 | ||
Current 3.4A | ||
Pitch 1.27mm | ||
Termination Type Solder | ||
Housing Material Liquid Crystal Polymer | ||
Mount Type Surface | ||
Orientation Horizontal | ||
Connector System Board-to-Board | ||
Voltage 395 V | ||
Series CLP | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 1.27mm | ||
Contact Plating Gold | ||
Contact Material Phosphor Bronze | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals No | ||
The Samtec CLP series 1.27mm low profile dual wipe socket has 30 positions and surface mount lead style. It has 0.000254mm light selective gold in contact area and matte tin on tail.
Dual row
Pick & place pad
Alignment Pin
Tape and reel packaging
Liens connexes
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
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- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
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