Samtec CLP Series Horizontal Surface PCB Socket, 20-Contact, 2 Row, 1.27 mm Pitch Solder
- N° de stock RS:
- 227-1065
- Référence fabricant:
- CLP-110-02-L-D-BE-K-TR
- Fabricant:
- Samtec
Sous-total (1 bobine de 1200 unités)*
3 091,20 €
(TVA exclue)
3 740,40 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 27 avril 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité | Prix par unité | la bobine* |
|---|---|---|
| 1200 + | 2,576 € | 3 091,20 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 227-1065
- Référence fabricant:
- CLP-110-02-L-D-BE-K-TR
- Fabricant:
- Samtec
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Product Type | PCB Socket | |
| Number of Contacts | 20 | |
| Number of Rows | 2 | |
| Sub Type | Dual Wipe Socket | |
| Current | 3.4A | |
| Pitch | 1.27mm | |
| Termination Type | Solder | |
| Housing Material | Liquid Crystal Polymer | |
| Mount Type | Surface | |
| Orientation | Horizontal | |
| Connector System | Board-to-Board | |
| Voltage | 395 V | |
| Series | CLP | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 1.27mm | |
| Maximum Operating Temperature | 125°C | |
| Contact Plating | Gold | |
| Contact Material | Phosphor Bronze | |
| Standards/Approvals | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Product Type PCB Socket | ||
Number of Contacts 20 | ||
Number of Rows 2 | ||
Sub Type Dual Wipe Socket | ||
Current 3.4A | ||
Pitch 1.27mm | ||
Termination Type Solder | ||
Housing Material Liquid Crystal Polymer | ||
Mount Type Surface | ||
Orientation Horizontal | ||
Connector System Board-to-Board | ||
Voltage 395 V | ||
Series CLP | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 1.27mm | ||
Maximum Operating Temperature 125°C | ||
Contact Plating Gold | ||
Contact Material Phosphor Bronze | ||
Standards/Approvals No | ||
The Samtec CLP series 1.27mm low profile dual wipe socket has 10 positions and surface mount lead style. It has 0.000254mm light selective gold in contact area and matte tin on tail.
Dual row
Pick & place pad
Alignment Pin
Tape and reel packaging
Liens connexes
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Straight Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Straight Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder