Samtec CLP Series Horizontal Surface PCB Socket, 20-Contact, 2 Row, 1.27 mm Pitch Solder
- N° de stock RS:
- 227-1065
- Référence fabricant:
- CLP-110-02-L-D-BE-K-TR
- Fabricant:
- Samtec
Sous-total (1 bobine de 1200 unités)*
3 091,20 €
(TVA exclue)
3 740,40 €
(TVA incluse)
Ajouter 1200 unités pour bénéficier d'une livraison gratuite
Temporairement en rupture de stock
- Expédition à partir du 19 mars 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité | Prix par unité | la bobine* |
|---|---|---|
| 1200 + | 2,576 € | 3 091,20 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 227-1065
- Référence fabricant:
- CLP-110-02-L-D-BE-K-TR
- Fabricant:
- Samtec
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Number of Contacts | 20 | |
| Product Type | PCB Socket | |
| Number of Rows | 2 | |
| Sub Type | Dual Wipe Socket | |
| Pitch | 1.27mm | |
| Current | 3.4A | |
| Housing Material | Liquid Crystal Polymer | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Horizontal | |
| Connector System | Board-to-Board | |
| Voltage | 395 V | |
| Series | CLP | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 1.27mm | |
| Contact Plating | Gold | |
| Maximum Operating Temperature | 125°C | |
| Contact Material | Phosphor Bronze | |
| Standards/Approvals | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Number of Contacts 20 | ||
Product Type PCB Socket | ||
Number of Rows 2 | ||
Sub Type Dual Wipe Socket | ||
Pitch 1.27mm | ||
Current 3.4A | ||
Housing Material Liquid Crystal Polymer | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Horizontal | ||
Connector System Board-to-Board | ||
Voltage 395 V | ||
Series CLP | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 1.27mm | ||
Contact Plating Gold | ||
Maximum Operating Temperature 125°C | ||
Contact Material Phosphor Bronze | ||
Standards/Approvals No | ||
The Samtec CLP series 1.27mm low profile dual wipe socket has 10 positions and surface mount lead style. It has 0.000254mm light selective gold in contact area and matte tin on tail.
Dual row
Pick & place pad
Alignment Pin
Tape and reel packaging
Liens connexes
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Straight Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Straight Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder