TE Connectivity Z-PACK Series Vertical Board PCB Header, 175 Contact(s), 2 mm Pitch, 7 Row, Unshrouded

Voir l’ensemble des PCB Headers

Sous-total (1 tube de 10 unités)*

206,52 €

(TVA exclue)

249,89 €

(TVA incluse)

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  • Expédition à partir du 24 février 2026
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Tube(s)
le tube
Prix par unité*
1 +206,52 €20,652 €

*Prix donné à titre indicatif

N° de stock RS:
480-994
Numéro d'article Distrelec:
304-50-002
Référence fabricant:
5106510-1
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

Z-PACK

Pitch

2mm

Current

1.5A

Housing Material

Fibreglass Polyester

Number of Contacts

175

Number of Rows

7

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Row Pitch

2mm

Minimum Operating Temperature

-55°C

Termination Type

Solder

Contact Gender

Male

Maximum Operating Temperature

125°C

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, UL 94V-0

Mating Pin Length

5.25mm

Pays d'origine :
CN
The TE Connectivity Hard Metric Backplane PCB Mount Header is engineered for high-performance applications with data rates of up to 1 Gb/s. Designed with 25 columns and 7 rows, this mezzanine connector accommodates a total of 175 positions, ensuring reliable connectivity in a compact form factor. Its vertical mounting orientation streamlines installation on printed circuit boards, while the robust construction, featuring a grey polyester housing, provides durability and resilience against environmental stresses. With nickel underplating and gold plating on the contacts, it guarantees optimal electrical performance and corrosion resistance. This connector is an ideal choice for traditional backplane systems where securing ground return shielding and signal integrity are paramount, making it a preferred solution in telecommunications and industrial settings.

Offers a compact design with 175 signal positions for efficient space utilisation

Connects easily to printed circuit boards, enhancing installation flexibility

Constructed with high-quality materials for improved durability and longevity

Features consistent data transmission rates, ensuring system reliability

Compatible with traditional backplane architectures for versatile application

Provides effective shielding to reduce crosstalk and maintain signal quality

Optimised for a wide operating temperature range, accommodating diverse environmental conditions

Available in packaging quantities that suit your project requirements

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