TE Connectivity Z-PACK Series Vertical Board PCB Header, 154 Contact(s), 2 mm Pitch, 7 Row, Unshrouded

Sous-total (1 tube de 30 unités)*

292,10 €

(TVA exclue)

353,44 €

(TVA incluse)

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  • Expédition à partir du 09 mars 2026
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Tube(s)
le tube
Prix par unité*
1 +292,10 €9,737 €

*Prix donné à titre indicatif

N° de stock RS:
478-126
Référence fabricant:
5352332-1
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

Z-PACK

Product Type

PCB Header

Pitch

2mm

Current

1.5A

Number of Contacts

154

Housing Material

Fibreglass Polyester

Number of Rows

7

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Gold

Contact Material

Phosphor Bronze

Row Pitch

2mm

Minimum Operating Temperature

-55°C

Tail Pin Length

3.7mm

Maximum Operating Temperature

125°C

Contact Gender

Male

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC, EU RoHS Directive 2011/65/EU, UL 94V-0

Distrelec Product Id

304-48-944

Pays d'origine :
CN
The TE Connectivity Hard metric backplane PCB mount header offers a robust solution for seamless board-to-board connectivity in demanding applications. Designed with a 2mm centreline pitch, it accommodates up to 154 positions across a 22-column and 7-row configuration. Its versatility makes it ideal for mezzanine backplane architectures, ensuring reliable performance at data rates of up to 1 Gb/s. The product’s innovative design features a vertical orientation and is presented in an elegant grey finish, enabling easy integration into a variety of electronics systems. Built for durability, the header is compliant with key industry standards, ensuring it meets rigorous operational demands within diverse environments. With a temperature range from -55 to 125 °C, this connector is engineered to perform reliably in extreme conditions.

Utilises nickel underplating to ensure excellent conductivity

Designed to facilitate easy assembly with board mounting capabilities

Boasts a compact footprint while maintaining high performance

Withstands extreme temperatures, making it suitable for a wide range of applications

Equipped with signal application capabilities for reliable communications

Included in a series offering compatibility with various other connectors

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