TE Connectivity Z-PACK Series Vertical Board PCB Header, 125 Contact(s), 2 mm Pitch, 5 Row, Unshrouded

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Sous-total (1 paquet de 20 unités)*

246,97 €

(TVA exclue)

298,83 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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Paquet(s)
le paquet
Prix par unité*
1 +246,97 €12,349 €

*Prix donné à titre indicatif

N° de stock RS:
478-085
Référence fabricant:
5100141-4
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

Z-PACK

Product Type

PCB Header

Pitch

2mm

Current

1.5A

Housing Material

Fibreglass Reinforced Polybutylene Terephthalate

Number of Contacts

125

Number of Rows

5

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Gold

Contact Material

Phosphor Bronze

Termination Type

Solder

Row Pitch

2mm

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

125°C

Tail Pin Length

3.7mm

Contact Gender

Male

Standards/Approvals

2016, China RoHS 2 MIIT Order No 32, EU ELV 2000/53/EC, EU RoHS 2011/65/EU

Distrelec Product Id

304-49-997

Pays d'origine :
CN
The TE Connectivity hard metric backplane PCB mount header is designed to accommodate data rates of up to 1 Gb/s, making it an ideal choice for high-performance computing applications. With a robust construction featuring 25 columns and 5 rows, this connector supports a total of 125 positions, ensuring reliable signal integrity and efficient data transmission. The vertical design optimises space and simplifies board layout for modern electronic systems, while the grey housing provides a neutral aesthetic. This component is perfect for mezzanine configurations, guaranteeing a seamless interface between boards. Engineered from durable PBT GF material, it withstands extreme operating conditions ranging from -55 to 125 °C, establishing itself as a reliable solution for various environmental settings. Compatible with a range of TE’s Z-PACK connectors, it is tailored for those seeking quality and durability in their electronic connections.

Constructed for high-speed applications, supporting data rates up to 1 Gb/s

Designed with a total of 125 positions for flexible connectivity

Compatible with mezzanine architectures, optimising dense circuit board designs

Made from durable materials that resist thermal and physical stresses

Features an easy-to-use through-hole press-fit termination method

Available in a vertical mount orientation to enhance PCB layout efficiency

Engineered to comply with EU RoHS and ELV directives, ensuring environmental safety

Offers a dependable connection with a nickel underplating and gold plating for excellent conductivity

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