TE Connectivity AMPMODU Series Vertical Board PCB Header, 12 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

Voir l’ensemble des PCB Headers

Sous-total (1 plateau de 25 unités)*

201,19 €

(TVA exclue)

243,44 €

(TVA incluse)

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  • Prêt à être expédié à partir du 18 mai 2026
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1 +201,19 €8,048 €

*Prix donné à titre indicatif

N° de stock RS:
480-236
Numéro d'article Distrelec:
304-63-913
Référence fabricant:
102699-5
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

2.54mm

Current

3A

Number of Contacts

12

Housing Material

Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board, Wire-to-Board

Contact Plating

Gold

Contact Material

Copper Alloy

Termination Type

Solder

Row Pitch

2.54mm

Tail Pin Length

6.35mm

Contact Gender

Male

Standards/Approvals

CSA LR7189, UL E28476

Voltage

750Vrms

Pays d'origine :
US
The TE Connectivity 12-position MODII header connector is designed for robust and reliable board-to-board and wire-to-board connections. Featuring a fully shrouded design, it ensures secure mating and alignment, making it ideal for various electronic applications. With vertical PCB mounting orientation, it integrates seamlessly into your equipment, enhancing connectivity without compromising on space. The connector is suitable for fully loaded configurations, ensuring optimal performance even in demanding environments. Its high insulation resistance and dielectric withstanding voltage further attest to its reliability, making it a perfect choice for professionals seeking durability and efficiency in their designs.

Robust construction enhances durability in various applications

Vertical orientation allows for compact designs and space-saving solutions

Fully shrouded design improves mating stability and reduces misalignment risks

High insulation resistance ensures reliable performance in challenging environments

Compatible with board-to-board and wire-to-board systems for versatility

Efficient thermal management supports high-performance operation

Easy integration into existing PCB designs for streamlined production

Meets rigorous industry standards for safety and compliance

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