TE Connectivity AMPMODU Series Vertical Board PCB Header, 20 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

Sous-total (1 bobine de 2500 unités)*

208,13 €

(TVA exclue)

251,84 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 06 juillet 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s)
la bobine
Prix par unité*
1 +208,13 €0,083 €

*Prix donné à titre indicatif

N° de stock RS:
475-199
Numéro d'article Distrelec:
304-50-202
Référence fabricant:
146869-1
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

2.54mm

Current

3A

Number of Contacts

20

Housing Material

Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Gold

Contact Material

Copper Alloy

Termination Type

Solder

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Maximum Operating Temperature

105°C

Tail Pin Length

2.79mm

Standards/Approvals

CSA LR7189, UL E28476

Non conforme

Pays d'origine :
MX
The TE Connectivity PCB Mount Header provides a robust and reliable solution for board-to-board connections. Designed with versatility in mind, this vertical connector accommodates a variety of applications, ensuring seamless integration into your electronic designs. With its 20 positions and a centred pitch of 2.54 mm, this header ensures optimal space utilisation on your circuit board. Its breakaway feature enhances modularity, allowing for easy customisation and assembly in complex systems. Constructed from high-quality materials, this connector guarantees durability and performance across a wide temperature range, making it an excellent choice for demanding environments.

Provides a solid solution for board-to-board connectivity

Accommodates various applications effortlessly

Designed for optimal space utilisation on circuit boards

Enhances modularity, facilitating easy customisation

Constructed with high-quality materials for durability

Performs reliably in demanding temperature environments

Promotes easy assembly in complex electronic designs

Liens connexes