TE Connectivity AMPMODU Series Vertical Board PCB Header, 12 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

Voir l’ensemble des PCB Headers

Sous-total (1 tube de 112 unités)*

210,91 €

(TVA exclue)

255,20 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 16 mars 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Tube(s)
le tube
Prix par unité*
1 +210,91 €1,883 €

*Prix donné à titre indicatif

N° de stock RS:
471-891
Numéro d'article Distrelec:
304-48-108
Référence fabricant:
1-103735-1
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

3A

Pitch

2.54mm

Number of Contacts

12

Housing Material

Thermoplastic

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Material

Brass

Contact Plating

Gold

Row Pitch

2.54mm

Termination Type

Solder

Minimum Operating Temperature

65°C

Maximum Operating Temperature

105°C

Tail Pin Length

3.3mm

Contact Gender

Male

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Mating Pin Length

5.84mm

Voltage

60 V

Non conforme

Pays d'origine :
MX
The TE Connectivity PCB Mount Header is a versatile interconnect solution designed for seamless wire-to-board connections in various electronic applications. Featuring a fully shrouded design, this connector boasts a compact 12-position configuration with a 2.54 mm centreline, making it ideal for space-constrained environments. Engineered for reliability, the header ensures a secure electrical connection through its through-hole solder termination method. The robust construction facilitates ease of installation, while the high-quality materials selected enhance the performance across a wide operating temperature range. This product is an essential choice for engineers seeking dependable connectivity solutions in demanding conditions.

Compact design optimised for space efficiency

Fully shrouded to provide protection against environmental factors

Reliable wire to board connection for improved signal integrity

Solder termination method enables strong lasting connections

Thermoplastic housing ensures longevity and durability

Mating retention mechanism enhances connection stability

Liens connexes