TE Connectivity AMPMODU Series Vertical Board PCB Header, 10 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

Voir l’ensemble des PCB Headers

Sous-total (1 plateau de 240 unités)*

692,21 €

(TVA exclue)

837,57 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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Prix par unité*
1 +692,21 €2,884 €

*Prix donné à titre indicatif

N° de stock RS:
473-716
Référence fabricant:
103169-3
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

3A

Pitch

2.54mm

Number of Contacts

10

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Plating

Tin

Contact Material

Copper Tin, Phosphor Bronze

Minimum Operating Temperature

-65°C

Row Pitch

2.54mm

Termination Type

Solder

Maximum Operating Temperature

105°C

Standards/Approvals

CSA LR7189, RoHS, UL E28476

Voltage

250 V

Distrelec Product Id

304-48-462

Non conforme

Pays d'origine :
US
The TE Connectivity PCB Mount Header is an essential component designed for reliable, vertical board-to-board connections. Featuring fully shrouded connectors, this product ensures a snug fit and maximum protection against potential disruptions. With 10 positions arranged in 2 rows and a standard 2.54 mm centreline, it’s tailored for efficient space management on printed circuit boards. This versatile connector suits a variety of applications, from consumer electronics to automotive systems, providing a dependable interface for signal transmission. Its advanced design includes gold and nickel plating to enhance performance and durability, making it a top choice for engineers seeking quality and reliability in connectivity solutions.

Fully shrouded design prevents accidental disconnections

Optimised for board to board applications ensuring efficient signal transfer

Supports a broad operating temperature range catering to diverse environmental conditions

Constructed from thermoplastic for superior durability and resilience

Polarisation feature simplifies the mating process reducing assembly time

Compact footprint maximises space utilisation on PCBs

Compatible with various industry standards enhancing integration flexibility

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