TE Connectivity MICTOR Series Vertical Board PCB Header, 80 Contact(s), 0.8 mm Pitch

Sous-total (1 plateau de 15 unités)*

247,92 €

(TVA exclue)

299,98 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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Prix par unité*
1 +247,92 €16,528 €

*Prix donné à titre indicatif

N° de stock RS:
479-174
Référence fabricant:
1658015-2
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

MICTOR

Product Type

PCB Header

Pitch

0.8mm

Current

1.25A

Housing Material

Liquid Crystal Polymer

Number of Contacts

80

Orientation

Vertical

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Termination Type

Surface Mount

Row Pitch

0.8mm

Minimum Operating Temperature

65°C

Maximum Operating Temperature

125°C

Standards/Approvals

UL 94 V-0

Voltage

125 V

Distrelec Product Id

304-53-692

Pays d'origine :
CN
The TE Connectivity PCB Mount Header is a meticulously engineered interconnect solution designed for vertical board-to-board applications. This device accommodates 80 positions with a pitch of 0.8 mm, making it an ideal choice for complex electronic systems requiring reliable power and signal integrity. Its gold-plated contacts ensure superior conductivity and durability, while the compact form factor allows for efficient space utilisation within Enclosures. Built from liquid crystal polymer, this header offers excellent thermal stability and resistance to wear, making it suitable for demanding environmental conditions. With robust mating retention features and a streamlined surface mount termination method, the PCB Mount Header seamlessly integrates into a variety of applications, ensuring both performance and ease of assembly.

Vertical orientation optimises space within tight electronic layouts

100 Ω impedance supports minimal signal loss for high-frequency applications

Operating temperature range facilitates use in diverse environments

Low halogen content enhances compliance with environmental regulations

Stack height of 11 mm provides a compact solution for multi-layer setups

Seamless integration into existing assemblies increases compatibility

Premium-quality materials contribute to long-lasting performance

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